| Title |
The Development of Bumped Wafer Inspection System Using the Confocal Principle |
| Authors |
오현우(Hyunwoo Oh) ; 김웅식(Woongsik Kim) |
| DOI |
https://doi.org/10.5573/ieie.2019.56.7.47 |
| Keywords |
Confocal Principle; Inspection System; Solder Bump; Semiconductor Wafer; Packaging |
| Abstract |
In the modern industry, the package size is becoming smaller due to the miniaturization and weight reduction of electronic devices. Flip-chip packaging is used in which forms a solder bump and performs compression is used as a method for bonding semiconductor devices. IF the heights of the solder bumps are not uniform in the flip-chip packaging, the defective rate is increased because the crimping is not performed. Various methods for measuring the three-dimensional shape of such a bump have been studied. Particularly, the method using the confocal principle has an advantage that the roughness and the height change of the surface can be measured more quickly then the conventional shape measuring method. Therefore, this paper has developed a three-dimensional shape measurement system of bumps using confocal techniques to measure individual heights and three-dimensional shapes of bumps. |