| Title |
Physical and Electrical Properties of WOx Thin Films Fabricated by Sputtering Method for the Self-cleaning Passivation |
| Authors |
김필중(Phil-Jung Kim) ; 박용섭(Yong Seob Park) |
| DOI |
https://doi.org/10.5573/ieie.2025.62.1.29 |
| Keywords |
WOx; Sputtering; Resistivity; Contact angle; Hardness |
| Abstract |
WOx thin films were deposited at various RF powers using a dual magnetron sputtering device equipped with two tungsten (W) targets, and the physical, structural, and electrical properties of the thin films produced were investigated. When depositing WOx thin films, increasing the RF power of the target enhanced the sputtering effect, which resulted in more uniform and dense growth of the thin films. As the RF power increased, the increase in the tissue density enhanced the hardness and elastic modulus properties, and the tungsten-oxygen bond ratio increased due to the increased tungsten atom ratio in the thin film. In addition, the crystallinity of the thin film increased due to the enhanced sputtering effect as the RF power increased, and the surface roughness value increased due to the increased tungsten atom ratio on the thin film surface, and the hydrophobic properties of the surface improved as the contact angle size increased. In addition, as the RF power increased, the electrical properties, such as resistivity and sheet resistance, decreased, and as a result, it is judged that the metallicity was improved due to the increased tungsten-oxygen bonding due to the increased tungsten atom ratio in the thin film. The surface properties such as surface roughness and contact angle characteristics of the WOx thin film secured in this study and the physical properties such as improved hardness are attributed to the durability of the WOx film as a functional thin film, and since the electrical resistance value can be adjusted from a semiconductor to a conductor, it was confirmed that WOx can be used as a passivation coating material capable of self-cleaning in the smart window market. |