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Journal of the Korea Concrete Institute

J Korea Inst. Struct. Maint. Insp.
  • Indexed by
  • Korea Citation Index (KCI)
Title Experimental Study on the Flexural Behavior of GFRP Square Tubes Strengthened with Stainless Steel Plates Considering Bond Performance
Authors 정재원(Jae-Won Jeong) ; 최진철(Jin-Chul Choi) ; 박해용(Hae-Yong Park) ; 이용택(Yong-Taeg Lee) ; 김승훈(Seung-Hun Kim)
DOI https://doi.org/10.11112/jksmi.2026.30.5.92
Page pp.92-190
ISSN 2234-6937
Keywords 접착접합; 부착성능 활용률; 휨거동; GFRP 각관; 스테인리스 판 Adhesive bonding; Bond performance utilization ratio; Flexural behavior; GFRP square tube; Stainless steel plate
Abstract This study evaluated the bond performance and flexural behavior of glass fiber-reinforced polymer(GFRP) square tubes strengthened with stainless steel plates adhesively bonded to their top and bottom surfaces. Bond tests were conducted with varying bonded lengths and widths, and four-point bending tests were performed on specimens with clear spans of 400?1,500 mm. As the bonded area increased, the nominal mean bond stress decreased from 5.3 to 1.5 MPa, indicating that the maximum bond load did not increase proportionally. With increasing span, the maximum load decreased from 25.5 to 12.8 kN, whereas the maximum flexural moment increased from 1.8 to 4.4 kN?m. The linear variable differential transformer(LVDT)-based equivalent curvature at the maximum moment ranged from 2.1 × 10-4 to 2.8 × 10-4 mm-1. Assuming full composite action, the stainless steel plates carried approximately 69.0% of the flexural moment. At 30% of the maximum flexural moment, all utilization ratios were below 1.0 for the assumed 100 mm bond length, whereas those of RSCW1300 and RSCW1600 were 1.03 and 1.15, respectively, for the 200 mm bond length. Short-span specimens exhibited local crushing near the loading points, while long-span specimens showed out-of-plane deformation and longitudinal delamination of the upper GFRP surface. The bond performance utilization ratio should be interpreted as a relative indicator based on nominal mean bond stress.