Mobile QR Code QR CODE : The Transactions of the Korean Institute of Electrical Engineers
Title Preparation and dielectric properties of polyimide thin films by vapor deposition polymerization method
Authors 이덕출 ; 김형권
Page pp.380-385
ISSN 1975-8359
Keywords 폴리아믹산 ; 진공증착 중합 ; 폴리이미드 ; 열경화 ; 비유전율 polyamic acid ; vapor deposition polymerization ; Polyimide ; Curing ; Relative permittivity
Abstract Thin films of polyamic acid(PAA) were fabricated by vapor deposition polymerization(VDP) from pyromellitic dianhydride(PMDA) and 4,4'-diamino diphenyl ether(DDE). Thin films of polyimide(PI) were obtained by curing PAA, and their dielectric properties have been measured. The uniform thin films of PI formed by curing PAA at 300 .deg. C for 1 hr. which was confirmed by Fourier transform Infrared spectroscopy(FT-IR) absorption at 720, 1380, 1780c m_{-1}. Relative permittivity and tan .delta. were 3.9 and 0.008 at 10kHz, respectively. (author). 8 refs., 11 figs., 1 tab.1 tab.