| Title |
Sodalime-sodalime Electrostatic Bonding using Amorphous Silicon Interlayer and Its Application to FEA Packging |
| Authors |
주병권(Ju, Byeong-Kwon) ; 이덕중(Lee, Duck-Jung) ; 최우범(Choi, Woo-Beom) ; 김영조(Kim, Young-Cho) ; 이남양(Lee, Nam-Yang) ; 오명환(Oh, Myung-Hwan) |
| Keywords |
sodalime-sodalime bonding ; electrostatic bonding ; amorphous silicon interlayer ; field emitter array ; FED tubeless packaging |
| Abstract |
As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current. |