KIEE - The Transactions of the Korean Institute of Electrical Engineers

Mobile QR Code QR CODE : The Transactions of the Korean Institute of Electrical Engineers

QR CODE : The Transactions of the Korean Institute of Electrical Engineers

The Transactions of the Korean Institute of Electrical Engineers

The Transactions of the Korean Institute of Electrical Engineers

ISO Journal TitleTrans. Korean. Inst. Elect. Eng.

SCImago Journal & Country Rank

Main Menu

Journal Search

PDF INFO


Title	Si-to-Si Electrostatic Bonding using LSG Film as an Interlayer
Authors	주병권(Ju, Byeong-Gwon) ; 정지원(Jeong, Ji-Won) ; 이덕중(Lee, Deok-Jung) ; 이윤희(Lee, Yun-Hui) ; 최두진(Choe, Du-Jin) ; 오명환(O, Myeong-Hwan)
Page	pp.672-675
ISSN	1975-8359
Keywords	Si-Si bonding ; electrostatic bonding ; LSG interlayer ; MEMS
Abstract	Si-to-Si electrostatic bonding was carried out by employing LSG interlayer instead of conventional Corning #7740 interlayer in order to improve bonding properties. The surface roughness and dielectric breakdown field of the LSG interlayers deposited on Si substrates were investigated. Also, the bonding interface, bonding strength and bonding mechanism were discussed for the electrostatically-bonded Si-Si wafer pairs having LSG interlayers.

© KIEE All right's reserved

This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0/) which permits unrestricted non-commercial use, distribution and reproduction in any medium, provided the original work is property cited.