| Title |
Fabrication and Characteristics Test of Micro Heat Pipe Array for IC Chip Cooling |
| Authors |
박진성 ; 최장현 ; 조형철 ; 조한상 ; 양상식 ; 유재석 |
| Keywords |
Micro Heat Pipe ; Cooling ; Thermal Management ; Package ; Capillary |
| Abstract |
This paper presents an experimental investigation on the heat trensfer characteristic of micro pipe (MHP) array with 38 triangular microgrooves. A heat pipe is an effective heat exchanger operating without external power. The heat pipe transfers heat by means of the latent heat of vaporization and two-phase fluid flow driven by the capillary force. The overall size of the MHP array can be put undermeath a microelectonic die and integrated into the electrronic package of a microelectronin device to dissipate the heat from the die. The MHP array is fabricated by micromachining with a silicon wafer and a glass substrate. The MHP was filled with water and sealed. The experimental results show the temperature decrease of 12.1°C at the evaporator section for the input power of 5.9 W and the improvement of 28% in the heat transfer rate. |