| Title |
Effect of RF Etch Conditions on Metal Contact Resistance |
| Authors |
김도우(Kim, Do-U) ; 정철모(Jeong, Cheol-Mo) ; 구경완(Gu, Gyeong-Wan) ; 왕진석(Wang, Jin-Seok) |
| Keywords |
metal contact resistance ; RF etch conditions ; barrier metal ; RTP |
| Abstract |
The resistances of metal2 contact to metall and poly Si are checked by various RF etch conditions in terms of pre-cleaning. The changes of resistance are evaluated by statistical analysis method(SAS) for the AC bias power, coil power and RF target. The contact area on poly Si is shown by TEM image and the distributions of contact resistance according to ar etch target and RTP are investigated. The RTP groups have larger variations than normal RF etch targets. When the RF etch target becomes lower and coil power becomes higher, the resistances of metal2 contact to metals and poly Si have lower contact resistance. But the condition of AC bias power did not satisfied low meta12 contacts resistance for metall and poly Si simultaneously. The R-square of ststistical analysis was 0.98 for resistances of meta12 contact to poly Si and 0.87 for resistances of meta12 contact to metall. |