| Title |
THe Novel Silicon MEMS Package for MMICS |
| Authors |
권영수(Gwon, Yeong-Su) ; 이해영(Lee, Hae-Yeong) ; 박재영(Park, Jae-Yeong) ; 김성아(Kim, Seong-A) |
| Keywords |
MEMS ; high resistivity silicon (HRS) ; silicon package ; wafer level packaging ; MMIC |
| Abstract |
In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of S_11/ and -0.3㏈ of S_21 up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications. |