| Title |
Design and Fabrication of the System in Package for the Digital Broadcasting Receiver |
| Authors |
김지균(Kim, Jee-Gyun) ; 이헌용(Lee, Heon-Yong) |
| Keywords |
Digital Broadcasting ; System in Package ; System on Package ; Multi Chip Module ; Intermediate Frequency |
| Abstract |
This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from 776mm^2 to 144mm^2. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level. |