| Title |
Analysis of LED Package Properties by PCB Material and Via-hole Construction |
| Authors |
이세일(Lee, Se-Il) ; 양종경(Yang, Jong-Kyung) ; 김성현(Kim, Sung-Hyun) ; 이승민(Lee, Seung-Min) ; 박대희(Park, Dae-Hee) |
| Keywords |
LED ; Junction Temperature ; Thermal Resistance ; PCB ; Via-hole |
| Abstract |
In this paper, we confirmed the thermal & optical properties for improving the heat transfer coefficient by changing the via hole size and in FR4 PCB with the same area. Osram 1W power LED Package (Golden Dragon) was used and the K-factor which is relative constant between LED junction temperature and forward bias was measured with power source meter(KEITHLEY 2430) to measure the thermal resistance from PCB configuration. As results, thermal resistance in metal PCB came out to the lowest as 26 [°C/W] and thermal resistance in FR4 PCB without via-holes emerged as the highest as 69 [°C/W]. However thermal resistance of FR4 PCB could have decreased until 32[°C/W] in 0.6 mm by using the via hole. Also, the luminous flux could have improved, too. |