KIEE - The Transactions of the Korean Institute of Electrical Engineers

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The Transactions of the Korean Institute of Electrical Engineers

The Transactions of the Korean Institute of Electrical Engineers

ISO Journal TitleTrans. Korean. Inst. Elect. Eng.

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Title	Structural and Physical Properties of Sealant Paste Prepared by Silica/Polymer Composites
Authors	윤종국(Yoon, Jong-Kuk) ; 박정일(Park, Jung-Il) ; 구경완(Koo, Kyung-Wan) ; Jang, Young-Sil(Jang, Young-Sil)
DOI	https://doi.org/10.5370/KIEE.2012.61.6.916
Page	pp.916-921
ISSN	1975-8359
Keywords	Silica composites ; Epoxy-acrylate ; Cross-linking ; Pot life ; UV curing
Abstract	Sealant paste with silica immersed in cross-linked epoxy-acrylate polymer resin was prepared by thermal and UV curing process. The curing mechanism of polymer resin resulted from 2 functional groups of epoxy and acrylic structure. The properties of microstructure, thermal conductivity and mechanical strength were investigated for its various applications. The adhesion strength is increased by increasing the thermal curing time until 15 minutes, and curing efficiency is saturated over 20 minutes. The increase rate per day of pot life and viscosity is 4.8%, indicating it has excellent storage stability. It is found that the formulation of silica pastes can be applied to heavy industries, building materials, display and various industries.

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