| Title |
A Study of Solar Cell Module using Conductive Film Bonding |
| Authors |
박정철(Park, Jung-Cheul) ; 양연원(Yang, Yeon-Won) |
| DOI |
https://doi.org/10.5370/KIEEP.2016.65.4.250 |
| Keywords |
CF ; Fillfactor ; Rseries ; Isc ; Low-temperature bonding ; Voc |
| Abstract |
In this paper, solar-cell modules were fabricated by low-temperature bonding method of construction using CF. CF adhesive strength of cells at 180 degree using 3bus bar structure was measured average 2.4N. As the bonding temperature got higher, Voc and Iscwas increased. And at 185^{\circ}C, Rseries was measured 0.013[{\Omega}] which is the highest point. At 185^{\circ}C, 2N and 6sec in bonding time, P_{max} was measured 3.954[W], fillfactor was measured 67.36[%] and efficiency was measured13.178[%] the highest point. |