| Title |
Experiments on the Heat Transfer and Pressure Drop Characteristics of a Channel with Pin-Fin Array |
| Keywords |
Electronic device ; 전자장비 ; Cooling technology ; 냉각기술 ; Pin-fin array ; 핀-휜 배열 ; Porosity ; 다공도 |
| Abstract |
Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cooling scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process. |