| Title |
Cooling Characteristics on the Forced Convection ofan Array of Electronic Components in Channel Flow(Ⅰ) : The Effect of H/B(without the Heat Sink) |
| Keywords |
Adiabatic heat transfer coefficient ; 단열 열전달계수 ; Adiabatic temperature ; 단열온도 ; Thermal wake ; 열후류 |
| Abstract |
Present study is concerned with an experimental study on the cooling charac-teristics of heat-generating components arranged in channels which are made by printed cir-cuit boards. To assess the thermal performance of the heat-generating components arranged by 5×11 in flow channel, three variables are used: the velocity of the fluid at the entrance, the height of channel, and row number of the component. The cooling characteristics of the heat- generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. Based on the experiment analysis, some conclusions can be drawn: First of all, the experiment and numerical analysis are identical comparatively; the heat transfer coefficient increases asH/B decreases. However, whenH/B is over 7.2, the effect ofH/B is rather trivial. The effect is the biggest at the first component from the entrance, and it decreases until the fully developed flow, where it becomes very con-sistent. The thermal wake function calculated for each row decreases asH/B increases. |