| Title |
Cooling Characteristics on the Forced Convection ofan Array of Electronic Components in Channel Flow(Ⅱ) |
| Keywords |
Adiabatic heat transfer coefficient ; 단열열전달계수 ; Adiabatic temperature ; 단열온도 ; Thermal wake ; 열후류 |
| Abstract |
Present study is concerned with an experimental study on the cooling characteristics of heat-generating components arranged in channels which are made by printed circuit boards. To estimate the thermal performance of the heat-generating components arranged by 5×11 in channel flow, three variables are used: the inlet velocity, the height of channel, and row number of the component. The cooling characteristics of the heat-generating components such as the surface temperature rise, the adiabatic temperature rise, the adiabatic heat transfer coefficient, and the effect of thermal wake are compared with the result of the experiment and the numerical analysis. The experimental result is in a good agreement with the numerical analysis. The heat transfer coefficient increases as the Reynolds number increases, while the thermal wake function calculated for each row decreases as the Reynolds number increases. In addition, it is found that Nu-Re correlation equation is identical to the previous studies, and the empirical correlation equation between the thermal wake function and Re is presented. |