| Title |
Development of Nanofluidic Thermosyphon Heat Sink |
| Authors |
이석호 ; 신동륜 ; 임택규 ; 이충구 ; 박기호 ; 이욱현 |
| Keywords |
Thermosyphon ; 열사이폰 ; Heat sink ; 히트싱크 ; Nanofluid ; 나노유체 |
| Abstract |
A heat sink system using nanofluidic thermosyphon for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150W at an overall temperature difference of 50℃ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. In the experimental study, the volume concentration of nano particles affect the system performance. Nanofluidic thermosyphon with 0.5% volume concentration showed the best performance. Nanofluid can increase CHF of the system compared with water as a working fluid. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink. |