| Title |
Performance Characteristics of Liquid-Cooling Heat Exchangers with MPCM Slurry Designed for Telecommunication Equipment |
| Authors |
전종욱(Jongug Jeon) ; 김용찬(Yongchan Kim) ; 최종민(Jong Min Choi) ; 현동수(Dong Soo Hyun) ; 윤린(Rin Yun) |
| Keywords |
마이크로캡슐잠열재 ; 열부하 ; 표면온도 ; 질량 유량 MPCM ; Heat load ; Surface temperature ; Mass flow rate |
| Abstract |
Electric and telecommunication industries are constantly striving towards miniaturiz-ation of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers with MPCM slurries were designed and tested by varying geometry and operating conditions. The liquid-cooling heat exchangers with 4-paths showed higher cooling performance than the others. The cooling performance of liquid cooling heat exchanger with MPCM slurries was more enhanced than that of the air cooling system. It’s performance was also slightly superior to that of the water cooling system at the inlet temperature of 19℃. |