| Title |
A Study of Diffusion Bonding Process for High Temperature and High Pressure Micro Channel Heat Exchanger Using Inconel 617 |
| Authors |
Chan Ho Song ; Seok Ho Yoon ; Joon Seok Choi |
| DOI |
http://dx.doi.org/10.6110/KJACR.2015.27.2.087 |
| Keywords |
마이크로 채널 열교환기 ; 인쇄기판형 열교환기 ; 인코넬 617 ; 확산접합 ; 열확산율 Micro channel heat exchanger ; PCHE ; Inconel 617 ; Diffusion bonding ; Thermal diffusivity |
| Abstract |
Recently, the heat exchangers are requiring higher performance and reliability since they are being used under the operating condition of high temperature and pressure. To satisfy these requirements, we need special materials and bonding technology. This study presents a manufacturing technology for high temperature and high pressure micro channel heat exchanger using Inconel 617. The bonding performance for diffusion bonded heat exchanger was examined and analyzed. The analysis were conducted by measuring thermal and mechanical properties such as thermal diffusivity and tensile strength, and parametric studies about bonding temperature and pressing force were also carried out. The results provided insight for bonding evaluation and the bonding condition of 1200℃, and 50 tons was found to be suitable for this heat exchanger. From the results, we were able to establish the base technology for the manufacturing of Inconel 617 heat exchanger through the application of the diffusion bonding. |