| Title |
A Study on the Thermal Performance of Embossing Surface Sandwich Panel During the Summer |
| Keywords |
Embossing surface sandwich panel ; 엠보싱 샌드위치 패널 ; Flat surface sandwich panel ; 평판 샌드위치 패널 ; Thermal performance ; 열적 성능 ; Heat transfer rate ; 열관류율 |
| Abstract |
The purpose of this research is to investigate the thermal performance of embossing surface sandwich panel and flat surface sandwich panel during the summer. To do this research, thermal performances in summer season at the six points of embossing surface sandwich panel and flat surface sandwich panel are investigated focusing on the temperature. Three kinds of embossing surface sandwich panel and one kind of flat surface sandwich panel are used for this research. At the same size of sandwich panel, the average temperature differences of flat surface sandwich panel between average temperature at the 0.5 mm below copper plate and average outside air temperature and surface temperature are higher than those of embossing surface sandwich panel. The average heat transfer rate of flat surface sandwich panel is higher than that of embossing surface sandwich panel.
More study will be needed about the size of diameter and height of embossing, and materials of embossing surface sandwich panel. |