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Journal of the Korea Concrete Institute

J Korea Inst. Struct. Maint. Insp.
  • Indexed by
  • Korea Citation Index (KCI)
Title Prediction of Crack Distribution for the Deck and Girder of Single-Span and Multi-Span PSC-I Bridges
Authors 정현진(Hyun-Jin Jung) ; 안효준(Hyojoon An) ; 김재환(Jaehwan Kim) ; 박기태(Kitae Park) ; 이종한(Jong-Han Lee)
DOI https://doi.org/10.11112/jksmi.2023.27.6.102
Page pp.102-110
ISSN 2234-6937
Keywords PSC-I 거더교; 단일손상; 이종손상; 열화모델; 바닥판 균열확산; 거더 균열확산 PSC-I girder bridge; Single damage; Heterogeneous damage; Deterioration model; Deck-crack spread; Girder-crack spread
Abstract PSC-I girder bridges constitute the largest proportion among highway bridges in Korea. According to the precision safety diagnosis data for the past 10 years, approximately 41.3% of the PSC-I bridges have been graded as C. Furthermore, with the increase in the aging of bridges, preemptive management is becoming more important. Damage and deterioration to the deck and girder with a long replacement cylce can have considerable impacts on the service and deterioration of a bridge. In addition, the high rate of device damages, including expansion joints and bearings, necessitates an investigation into the influence of the device damage in the structural members of the bridge. Therefore, this study defined representative PSC-I girder bridges with single and multiple spans to evaluate heterogeneous damages that incorporate the damage of the bridge member and device with the deterioration of the deck. The heterogeneous damages increased a crack area ratio compared to the individual single damage. For the single-span bridge, the occurrence of bearing damage leads to the spread of crack distribution in the girder, and in the case of multi-span bridges, expansion joint damage leads to the spread of crack distribution in the deck. The research underscores that bridge devices, when damaged, can cause subsequent secondary damage due to improper repair and replacement, which emphasizes the need for continuous observation and responsive action to the damages of the main devices.