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The Transactions of the Korean Institute of Electrical Engineers

The Transactions of the Korean Institute of Electrical Engineers

ISO Journal TitleTrans. Korean. Inst. Elect. Eng.
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  4. 10.5370/KIEE.2022.71.11.1585
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References

1 
S. Bernet, Nov 2000, Recent developments of high power converters for industry and traction applications, IEEE Trans. Power Electron., Vol. 15, No. 6, pp. 1102-1117DOI
2 
Z. Yang, Y. Chai, 2016, A survey of fault diagnosis for onshore gridconnected converter in wind energy conversion systems, Renew. Sustain. Energy. Rev., Vol. 66, pp. 345-359DOI
3 
C. A. Harper, 205, Electronic packaging and interconnection handbook., New York: McGraw-HillDOI
4 
A. H. Khalaja, S. K. Halgamugeb, 2017, A Review on efficient thermal management of air- and liquid-cooled data centers: From chip to the cooling system, Appl. Energy, Vol. 205, pp. 1165-1188DOI
5 
X. Jin, TWS. Chow, 2013, Anomaly detection of cooling fan and fault classification of induction motor using Mahalanobis-Taguchi system, Exp. Syst. Appl., Vol. 40, No. 15, pp. 5787-5795DOI
6 
S. Yang, D. Xiang, A. Bryant, P. Mawby, L. Ran, P. Tavner, Nov 2010, Condition monitoring for device reliability in power electronic converters: A review, IEEE Trans. Power Electron., Vol. 25, No. 11, pp. 2734-2752DOI
7 
, 2010, Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices With Heat Flow Through a Single Path, JEDEC Standard 51-14DOI
8 
D. Xiang, L. Ran, P. Tavner, S. Yang, A. Bryant, P. Mawby, Jan 2012, Condition monitoring power module solder fatigue using inverter harmonic identification, IEEE Trans. Power. Electron., Vol. 27, No. 1, pp. 235-247DOI
9 
D. Xiang, L. Ran, P. Tavner, A. Bryant, S. Yang, and P. Mawby, Nov/Dec 2011, Monitoring solder fatigue in a power module using case-above-ambient temperature rise, IEEE Trans. Ind. Appl., Vol. 47, No. 6, pp. 2578-2591DOI
10 
Z. Wang, B. Tian, W. Qiao, L. Qu, Feb 2015, Real-time aging monitoring for IGBT modules using case temperature, IEEE Trans. Ind. Electron., Vol. 63, No. 2, pp. 1168-1178DOI
11 
P. Sun, C. Gong, X. Du, Y. Peng, B. Wang, L. Zhou, May 2017, Condition monitoring IGBT module bond wires fatigue using short-circuit current identification, IEEE Trans. Power Electron., Vol. 32, No. 5, pp. 3777-3786DOI
12 
P. Ghimire, 2015, Real time monitoring and wear out of power modules, Ph.D. dissertation, Dept. Energy Technol., Aalborg Univ., Aalborg, DenmarkDOI
13 
A. Hensler, M. Thoben, 2011, Thermal impedance monitoring during power cycling tests, in Proc. PCIM Europe, pp. 241-246DOI
14 
H. Chen, B. Ji, P. Ghimire, V. Pickert, and W. Cao, Mar 2014, Real-time temperature estimation for power MOSFETs considering thermal aging effects, IEEE Trans. Device Mater. Rel., Vol. 14, No. 1, pp. 220-228DOI
15 
J. Zhang, X. Du, S. Zheng, 2020, Condition Monitoring of IGBT Module and Forced Air Cooling System Using Time Constants of Heat Sink Temperature Cooling Curve, in Proc. 2020 IEEE Applied Power Electronics Conference and Exposition (APEC), New Orleans, LA, USA, pp. 2554-2558DOI
16 
, 1999, ANIP9931E, Infineon Application Note. Calculation of major IGBT operating parameters. Infineon Technologies, , pp. -DOI