• 대한전기학회
Mobile QR Code QR CODE : The Transactions of the Korean Institute of Electrical Engineers
  • COPE
  • kcse
  • 한국과학기술단체총연합회
  • 한국학술지인용색인
  • Scopus
  • crossref
  • orcid
The Transactions of the Korean Institute of Electrical Engineers

The Transactions of the Korean Institute of Electrical Engineers

ISO Journal TitleTrans. Korean. Inst. Elect. Eng.
SCImago Journal & Country Rank

Journal Search

  1. Home
  2. Archive
  3. 2024-08 (Vol.73 No.08)
  4. 10.5370/KIEE.2024.73.8.1344
XML PDF INFO REF

References

1 
G. Ivanova, and A. C. Moreira, "Antecedents of Electric Vehicle Purchase Intention from the Consumer’s Perspective: A Systematic Literature Review," Sustainability, vol. 15, no. 4, 2878, 2023.DOI
2 
E. Robles, A. Matallana, I. Aretxabaleta, J. Andreu, M. Fernandez, and J. L. Martin, "The role of power device technology in the electric vehicle powertrain," International Journal of Energy Research, vol. 46, no. 15, pp. 22222-22265, 2022.DOI
3 
S. M. Lee, "Effect of Sawing Velocity Variation on Chipping Damage of Semiconductor Wafers with Different Thicknesses," Korean Journal of Metals and Materials, vol. 54, no. 8, pp. 598-604, 2016.DOI
4 
Y. Takahashi, H. Fukuda, Y. Yoneshima, H. Kitamura, and M. Maeda, "Solid-state microjoining mechanisms of wire bonding and flip chip bonding," Journal of Electronic Packaging, vol. 139, no. 4, 041010, 2017.DOI
5 
S. Simaafrookhteh, M. Khorshidian, and M. Momenifar, "Fabrication of multi-filler thermoset-based composite bipolar plates for PEMFCs applications: Molding defects and properties characterizations," International Journal of Hydrogen Energy, vol. 45, no. 27, pp. 14119-14132, 2020.DOI
6 
V. R. Manikam, and E. N. Tolentino, "Sintering of Ag paste for power devices die attach on Cu surfaces," 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), pp. 94-98, 2014.DOI
7 
N. S. Mohd Zubir, H. Zhang, G. Zou, H. Bai, Z. Deng, B. Feng, A. Wu, L. Liu, and Y. N. Zhou, "Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature," Journal of Electronic Materials, vol. 48, pp. 7562–7572, 2019.DOI
8 
K. K. Sridharan, S. Viswanathan, "Solder void modeling and its influence on thermal characteristics of MOSFETs in automotive electronics module," SAE International Journal of Passenger Cars-Electronic and Electrical System, vol. 10, no. 2, pp. 283-289, 2017.DOI
9 
R. Diehm, M. Nowottnick, and U. Pape, "Reduction of voids in solder joints an alternative to vacuum soldering," Proceedings of the IPC APEX EXPO, vol. 8, 2012.URL
10 
D. C. Katsis, and J. D. van Wyk, "Void-induced thermal impedance in power semiconductor modules: some transient temperature effects," IEEE Transactions on Industry Applications, vol. 39, no. 5, pp. 1239-1246, 2003.DOI
11 
K. C. Otiaba, R. S. Bhatti, N. N. Ekere, S. Mallik, E. H. Amalu, and M. Ekpu, "Thermal effects of die-attach voids location and style on performance of chip level package," 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011), pp. 231-236, 2011.DOI
12 
L. Chen, M. Paulasto-Krockel, U. Frohler, D. Schweitzer, and H. Pape, "Thermal impact of randomly distributed solder voids on Rth-JC of MOSFETs," 2008 2nd Electronics System-Integration Technology Conference, pp. 237-244, 2008.DOI
13 
A. S. Fleischer, L. H. Chang, and B. C. Johnson, "The effect of die attach voiding on the thermal resistance of chip level packages," Microelectronics Reliability, vol. 46, no. 5-6, pp. 794-804, 2006.DOI
14 
M. A. Dudek, L. Hunter, S. Kranz, J. J. Williams, S. H. Lau, and N. Chawla, "Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints," Materials Characterization, vol. 61, no. 4, pp. 433-439, 2010.DOI
15 
Z. Bin, and Q. Baojun, "Effect of voids on the thermal fatigue reliability of PBGA solder joints through submodel technology," 2008 10th Electronics Packaging Technology Conference, pp. 704-708, 2008.DOI
16 
N. Y. Choi, S. U. Zhang, “Numerical Evaluation of Thermal Resistance for Power MOSFET Packaged in Hermetic Method,” Jounral of Electrical Engineering & Technology, vol. 17, pp.1915–1920, 2022.DOI