| Title |
Development of High Resolution Optical System Design and Inspection Algorithm for Probe Card Inspection |
| Authors |
이대종(Dae-Jong Lee) ; 최민영(Min-Young Choi) ; 지평식(Pyeong-Shik Ji) |
| DOI |
https://doi.org/10.5370/KIEEP.2019.68.3.163 |
| Keywords |
High resolution optical system; Inspection algorithm; Image processing; roundness |
| Abstract |
Accurate contact between the probe needle and the wafer pad must be made to diagnose the electrical condition of the wafer. When a non-contact, over-contact, or contact other than the pad between the wafer pad and the needle is caused by a broken needle in the probe card device, a good wafer chip is recognized as a defect, so a system and program for diagnosing the needle condition are necessary. In this paper, we designed a high-resolution optical system with 1 optical resolution and developed an algorithm to ㎛ examine the condition of the needle. In order to verify the validity of the proposed method, a mask pattern having a diameter of 20 ㎛ was fabricated and tested. As a result of the experiment, the morphology consisting of expansion and erosion operation showed that the circular diameter measurement error was within ±1 , indicating the validity of the mechanical design and the circular ㎛ diameter detection algorithm. The result of the roundness test was 94.31%. |