| Title |
Bond Stress-Strain Predict Model with Inner Cover Thickness of Steel Wire Used in Void Deck Plate |
| Authors |
Kim, Hee-Hyeon ; Choi, Chang-Sik |
| DOI |
https://doi.org/10.5659/JAIK_SC.2018.34.1.41 |
| Keywords |
Void deck plate ; Bond characteristics ; Relative rib area ; Inner cover thickness ; Bond stress-strain model |
| Abstract |
In case of evaluating the bond stress of a void deck plate using a wire steel, there is no standard formula considering both the influence on the void and the type of the reinforcing bar. Therefore we proposed a model equation considered the bond characteristics of the void deck plate. A total of 46 specimens was carried out a direct pull-out test and the test variables were the presence of a void body, type of reinforcing bar, the inner cover thickness according to the location of reinforcing bars and bond region. As a result of the comparison between the steel bar and steel wire, the bond stress of the steel wire with the relative rib area of 0.071 is 4.5 ~ 28.58% lower than that of the steel bar with 0.092 and the bond stress reduction rate increases when the inner cover thickness is insufficient. In the case of the inner cover thickness of 1.7 and 2.7, the bond stress was reduced to 48.7 ~ 68.4%. In the inner cover thickness was 4.9 and 5.2, the bond stresses were equivalent to those of the solid specimens. It was confirmed that the average bond stress and strain were affected by the inner cover thickness. Therefore the predicted model for one module of the void deck plate is proposed and verified by considering the bond characteristics of the void deck plate. |