| Title |
A Study on the Implementation of Optimized Dechucking System |
| Authors |
Jong-Wan Seo ; Hee-Seok Suh ; Myong-Chul Shin |
| Keywords |
ESC ; Electrostatic Chuck ; Dechuck ; Wafer ; Modeling ; Simulation |
| Abstract |
After the semiconductor processing, wafer is attracted by ESC(Electrostatic Chuck) with remaining electric charge. That causes too many problems for examples, sliding of wafer, popping or broken. This paper presents the model of ESC for silicon wafer, which is modeled by electrical circuit component such as capacitor. The simulations using PSpice result in the phenomenon of silicon wafer was charged by ESC. In this paper we suggest the discharging method for wafer. |