| Title |
Implementation of LED BLU Using Metal core PCB with Anodizing Oxide Layer and Reflection Cup Structure |
| Authors |
Jae-Hyun Cho ; Min-Soo Lee |
| Keywords |
LED Package ; Anodizing Oxide Layer ; Metal Core PCB ; LED BLU |
| Abstract |
LED BLU(Back Light Unit), based on MCPCB(Metal Core Printed Circuit Board) with anodizing oxide dielectric layer and improved thermal dissipation property, are presented. Reflecting cups were also formed on the surface of the MCPCB such that optical coupling between neighboring chips were minimized for improving the photon extraction efficiency. LED chips were directly attached on the MCPCB by using the COB (Chip On Board) scheme. |