| Title |
Analysis of Thermal Properties in LED Package by Via hole of FR4 PCB |
| Authors |
Se-Il Lee ; Seung-Min Lee ; Dae-Hee Park |
| DOI |
http://dx.doi.org/10.5207/JIEIE.2010.24.12.057 |
| Keywords |
LED ; Thermal Resistance ; Junction Temperature ; Metal PCB ; FR4 PCB ; Via-hole |
| Abstract |
The efficiency of LED package is increasing by applying the high power, and a existing lighting is changing as the LED lighting. However, many problems have appeared by heat. Therefore, in order to solve thermal problems, LED lighting is designing in several ways, but the advantages of LED lighting is fading due to increase the prices and volumes. In this study, we try to improve the thermal performance by formation of via holes. The junction temperature and thermal resistance in the FR4-PCB with via-holes of 0.6[mm] was excellent in experiment and FR4-PCB with Via-holes of 0.6[mm] was excellent in simulation without solder. Further, the thermal resistance and the optical properties can be improved through a formation of via-holes. |