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Journal of the Korean Institute of Illuminating and Electrical Installation Engineers

ISO Journal TitleJ Korean Inst. IIIum. Electr. Install. Eng.
Title A Study on RGBY LED Light using a Vacuum Printing Encapsulation Systems Method
Authors Min-Suk Jang ; Yeoung-Woo Kim ; Gi-Hae Shin ; Joung-Wook Park ; Jin-Pyo Hong ; Sang-Bin Song ; Jae-Pil Kim
DOI http://dx.doi.org/10.5207/JIEIE.2011.25.2.010
Page pp.10-18
ISSN 1225-1135
Keywords VPES ; RGBY LED ; Experimental Designing Method ; Thermal Resistance
Abstract In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[°K], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[℃] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].