| Title |
Thermal Dissipation Characteristics of Multi-Chip LED Packages |
| Authors |
Byung-Ho Kim ; Cheol-Hee Moon |
| DOI |
http://dx.doi.org/10.5207/JIEIE.2011.25.12.034 |
| Keywords |
Heat Dissipation ; Thermal Resistance ; High-Power LED ; Multi-Chip LED ; Thermal Transient Analysis |
| Abstract |
In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package. |