| Title |
Effect of the Epoxy Mold on the Thermal Dissipation Behavior of LED Package |
| Authors |
Young-Tae Bang ; Cheol-Hee Moon |
| DOI |
http://dx.doi.org/10.5207/JIEIE.2012.26.2.001 |
| Keywords |
LED Package ; Epoxy Mold ; Heat Dissipation ; Junction Temperature ; FVM Simulation |
| Abstract |
LED package with 4[mm]-height mold was manufactured and the surface temperature was measured directly using both thermocouple and thermal infrared (IR) camera. FVM simulation was conducted to estimate the surface temperature of the same LED package under the same condition, by which the accuracy of the simulation was secured. Then, the effects of the height and thermal conductivity of the mold on the junction temperature of the LED package were investigated by FVM simulation. The results showed that the junction temperature decreased by 10[℃] when the mold height was 3～5[㎜], but the thermal conductivity of the mold didn’t affect the junction temperature significantly. |