| Title |
Optimization of Al 6063 Heat Sink using CFD Simulation and Comparative Analysis of Thermal Dissipation Properties with Thermal Conductive Polycarbonate |
| Authors |
In-Sung Her ; Se-Il Lee ; A-Ram Lee ; Young Moon Yu |
| DOI |
http://dx.doi.org/10.5207/JIEIE.2014.28.7.019 |
| Keywords |
LED Lamp ; Heat Sink ; Polycarbonate ; Heat Conduction ; Junction Temperature |
| Abstract |
In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was 5.6℃ higher, but total weight of it was 47 % less than the Al 6063. |