| Title |
Reliability Testing and Materials Evaluation of Si Sub-Mount based LED Package |
| Authors |
Young-Pil Kim ; Seok-Cheol Ko |
| DOI |
http://dx.doi.org/10.5207/JIEIE.2015.29.4.001 |
| Keywords |
Chip On Board(COB) ; Si Sub-Mount ; LED Package ; Reliability Test |
| Abstract |
The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources. |