| Title |
A Study on Switching Rectifier Module with High Power Density Improved Heat Dissipation Characteristics by Metal Bonded PCB |
| Authors |
Sung Hyun Kim ; Jong Ok Baek ; Tae Young Ahn |
| DOI |
http://dx.doi.org/10.5207/JIEIE.2017.31.3.041 |
| Keywords |
Bridgeless Rectifier ; Metal Bonded PCB ; High Density Power Supply ; Switching Rectifier ; PFC ; Power Density |
| Abstract |
In this paper, the experimental result on switching rectifier module with high power density which improved heat dissipation characteristics by metal bonded PCB was reported with a prototype. The height of the switching rectifier module was lowered under 13mm, and power density was increased to 127W/in3 while the module was designed with maximum output of 700W class. To minimize the internal heat and losses, bridgeless boost converter circuit was applied. As a consequence, the prototype was performed with 97.5% of maximum power transition efficiency and 99.8% of maximum power factor, hence it was confirmed that the prototype was stably operated under its maximum output by transferring the internal loss to outside effectively. |