| Title |
A Study of Heat Dissipation Performance Improvement of LED Lighting for Enhancing Optical Output Characteristics |
| Authors |
Byung-Jo Kim ; Young-Il Kim ; Sean-Hay Kim |
| DOI |
http://dx.doi.org/10.5207/JIEIE.2017.31.12.026 |
| Keywords |
LED ; Luminous Flux ; Heat Dissipation ; Heat Sink ; Radiant Heat Pins ; Copper Pipe |
| Abstract |
Heat dissipation is important for reliability, quality and lumen maintenance of LED lighting. The purpose of this paper is to analyze optical output properties of LED by improving heat transfer mechanism of a LED lighting fixture. Heat transfer structure of 180W LED lighting consists of heat sink plate, fin and copper pipe. Temperature measured was 146.3℃ at the solder point of LED package(3030) with only heat sink plate but dropped to 97.1℃ with heat sink plate, fin and copper pipe. Considering that the joint temperature was 120℃, it is advantageous to apply all three methods. If all three methods are applied, luminous flux was 20% higher than that of the case with only heat sink plate. For the same illumination condition, electricity consumption was reduced by 12%. |