| Title |
A Study on Effect of Temperature Decrease of Busbar by Epoxy Molding |
| Authors |
Jin-Wook Choe ; Woong-Yeop Lee ; Seok-Hyeon Nam ; Jin-Gyu Kim |
| DOI |
http://dx.doi.org/10.5207/JIEIE.2018.32.11.010 |
| Keywords |
Bus Duct ; NSPB ; Epoxy Molding ; Temperature Rise Test |
| Abstract |
As the number of large buildings and factories that consume a lot of electric power is increased, the use of bus ducts that can flow high current is increasing. The NSPB which is mainly used to connect the transformer and the switchboard has a structure in which a three-phase bus bars are spaced apart in a single metal enclosure. The bus bars are made of bare conductors or conductors coated with an epoxy powder or a heat-shrinkable tube. Bus ducts are required to have insulation characteristics for voltage, temperature characteristics due to current and mechanical characteristics due to short-circuit electromagnetic force. In this paper, temperature characteristics of epoxy molded bus bars were investigated through experiments. The maximum temperature change of the conductor with epoxy molding, the maximum conductor temperature change with the number of conductors and the space when the epoxy molding volume was the same and the maximum conductor temperature change with increasing current were compared. |