Jang Young-Min1
He Ying2
Cho Sang-Bok1
Kim Ji-Hoon2
Park Sung Min2
-
(Department of Electrical and Electronic Eng., University of Ulsan)
-
(Dept. of Electronic and Electrical Eng., Ewha Womans University)
Copyright © The Institute of Electronics and Information Engineers(IEIE)
Index Terms
CMOS, LiDAR, Resettable T-latch, TDC, Vernier.
I. INTRODUCTION
For the past decades, light detection and ranging(LiDAR) systems have been paid a
great deal of attention because of its feasibility to realize autonomous vehicles
[1]. In particular, panoramic scan LiDARs have been popular because it can detect the
reflected weak light signals from targets located in 360$^{\mathrm{o}}$ directions,
measure the distance to all the targets, and eventually visualize three dimensional
image of the surrounding scene [2]-[3]. For this purpose, high-sensitivity optical receivers are mandatory to recover the
target distance information precisely [4].
Fig. 1 shows the block diagram of a conventional LiDAR systems, where the laser transmitter(Tx)
emits light signals to targets, and sends simultaneously a start pulse to time-to-digital
converter(TDC) located right after the analog front-end(AFE) circuit of optical receiver(Rx)
for the initialization of distance measurements [5]-[10]. Then, the reflected lights from the targets arrive and are detected by a multi-channel
optical Rx array that converts the reflected light signals to stop-timing pulses and
conveys them to the same TDC with a certain amount of time delay. Finally, the TDC
discriminates the time interval between START and STOP pulses, thus estimating the
precise distance to targets.
Fig. 1. Block diagram of a typical LiDAR system.
II. CONVENTIONAL TDCS
Various TDCs have been previously reported in [11]-[16]. Among these, 1-dimensional flash TDC was the simplest configuration as shown in
Fig. 2, which consists of a series of CMOS buffer delay lines and comparators. Thereby,
START signals enter the input of the delay line, and pass through the serial delay
elements. Namely, START signals are delayed by an integer multiple of the buffer delay(${\tau}$$_{1}$).
Therefore, this flash TDC provides the advantages of high-speed timing, single-event
timing measurement, and simple digital implementation. However, it consumes large
power and occupies large chip area because of the required n delay elements and (n${-}$1)
comparators. Yet, its timing resolution is significantly limited.
In order to overcome the limited timing resolution of flash TDCs, Vernier TDC was
suggested in [11]-[12]. Fig. 3 depicts the block diagram, in which the delay(${\tau}$$_{1}$) of START signals is
larger than that(${\tau}$$_{2}$) of STOP signals. Then, the resolution(${\tau}$$_{1}$
${-}$ ${\tau}$$_{2}$) of Vernier TDC can be highly precise when compared to the previous
flash TDC. Nonetheless, this Vernier TDC consumes inevitably large chip area for long
range measurements, hence limiting its usage to cm-level short-reach applications.
Besides, the Vernier TDC output can cause comparison errors, especially when the START
pulse passes over the STOP pulse.
In order to compensate these walk errors effectively, dual-threshold TDC circuits
were developed in [8]-[10]. However, even a single channel of these TDCs occupied large chip area. Also, a timing
discriminator was mandatory before the TDC circuits [9]-[10].
Although other various TDCs have been developed, their structures were still complicated
and thus unsuitable for long-range LiDARs [14]-[16].
Fig. 2. Flash TDC with timing diagram.
Fig. 3. Vernier TDC with timing diagram.
Fig. 4. 2D Vernier TDC with timing diagram.
In order to save chip area, two-dimensional(2D) Vernier TDC was suggested in [13]. Yet, it has utilized timing comparators as delay cells in its two-dimensional architecture,
thereby limiting its operation speeds up to 50 MHz only. Hence, narrow pulses(typ.
3~5 ns) for LiDAR applications could be barely recovered. As shown in Fig. 4, the length of total delay line can be reduced significantly for similar resolution
to the 1-D Vernier TDC. However, this 2D Vernier TDC is dependent upon the delay length
of input pulses, hence occurring output errors.
III. PROPOSED 2D VERNIER TDC
In this paper, we propose a modified 2D Verniner TDC which utilizes resettable T-latch
circuits. Here, narrow input pulses are converted to wide digital signals, and therefore
it can avoid the ambiguity of the pulse overlapping between START and STOP pulses.
The resettable T-latch are reset instantly when a second reflected signal arrives.
Then, the second narrow pulse is converted to a next wide digital signal for the same
process.
Fig. 5. Block diagrams of (a) an original T-latch with its truth table, (b) the proposed
resettable T-latch with timing diagrams.
Fig. 5(a) illustrates the block diagram of a typical T-latch that comprises four NAND gates
with a clock signal. Its output goes high at a rising edge of input signals when clock
is high. Thereafter, the high output is maintained. Even when another consecutive
input signal enters, the output state of the T-latch cannot be changed. This operation
can be confirmed in the truth table.
On the contrary, Fig. 5(b) depicts the proposed resettable T-latch, where the output state can be reset to zero
as soon as another input signal arrives. Also, no clock signals are needed, hence
saving power consumption.
The proposed resettable T-latch comprises five NAND gates (NAND5 ~ NAND9), inverter
delay-lines, and an XOR gate(XOR1). NAND9 generates a low output at the rising edge
of an input pulse, and then is reset to high at the falling edge of the input pulse.
Then, the XOR1 compares the high output of Q2 and the inverted reset signal of R’,
thereby resetting the final pulse of Q2_OUT.
Fig. 5(b) shows the simulation results, where the proposed resettable T-latch succefully generates
the latched high-output with an incoming input signals, is reset when a next input
pulse enters, and then maintains high-state after a short reset pulse.
Fig. 6. (a) Block diagrams of the proposed 2D Vernier TDC, and (b) its simulation
of delay cell, (c) the errorneous simulation results of a conventional Vernier TDC,
and (d) the simulation results of the proposed 2D Vernier TDC with correct digital
output codes.
Fig. 6(a) shows the block diagram of the proposed 2D Vernier TDC, where two resettable T-latch
circuits are utilized. As aforementioned, since a high-state pulse can be maintained
until the arrival of a following input pulse, the output ambiguity of the pulse overlapping
between START and STOP signals can disappear in this architecture. Also, with this
resettable T-latch, there is no need of dual threshold comparators to measure the
time interval, hence omitting the walk error. Only the delay-offset in delay-cells
occurs error. The rest of the proposed TDC circuit shares the same architecture to
a conventional 2D Vernier TDC.
Fig. 6(b) depicts the simulation results of delay cells, in which no timing offset was assumed.
Since each delay cell was designed to provide the delay of 18 ns (${\tau}$$_{\mathrm{1)}}$
and 12 ns (${\tau}$$_{2}$), respectively, the timing resolution of the proposed 2D
Vernier TDC becomes 6 ns (= ${\tau}$$_{1}$${-}$${\tau}$$_{2}$) only.
Fig. 6(c) shows the simulation results of a conventional 2D Vernier TDC with the time difference
(${\Delta}$T) of 70 ns, where the erroneous bits occur. On the contrary, Fig. 6(d) compares those of the proposed 2D Vernier TDC, demonstrating the effective correction
of the error-bits and allowing the maximum time difference (${\Delta}$T) of 90 ns
that corresponds to the maximum detection range of 27 meters. It generates the 15-bit
output data of 000011111111111, which is finally converted to a 4-bit binary data
1011 via a Thermometer-to-Binary (T2B) encoder.
Hence, as long as the design space of the delay cells is large enough, the proposed
2D Vernier TDC is expected to detect the reflected pulses within the long range of
few hundred meters.
Fig. 7. Layout of the proposed 2-D Vernier TDC.
Fig. 7 depicts the layout of the proposed 2D Vernier TDC, where the chip core occupies the
area of 0.6 x 0.25 mm$^{2}$. DC simulations reveal the dynamic power dissipation of
0.15 mW from a single 1.2-V supply.
Table 1. Performance comparison of the proposed 2D Vernier TDC with prior arts.
Ref.
|
[12]
|
[13]
|
[14]
|
[15]
|
|
This work*
|
CMOS
tech.(nm)
|
90
|
65
|
90
|
130
|
130
|
130
|
Config.
|
PD
|
2D
|
TA
|
GRO
|
VR
|
RTL 2D
|
Supply(V)
|
1.3
|
1.2
|
1.0
|
1.5
|
1.5
|
1.2
|
Pulse width(ns)
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
3
|
Detection
range(m)
|
N/A
|
0.18
|
0.192
|
N/A
|
N/A
|
27
|
# of bits
|
5
|
7
|
9
|
11
|
12
|
4
|
Timing
resolution
|
20 ps
|
4.8 ps
|
1.25 ps
|
6 ps
|
8 ps
|
6 ns
|
Power
diss.(mW)
|
6.9
|
1.7
|
3.0
|
2.2-21
|
7.5
|
0.15
|
Core area
(mm2)
|
0.01
|
0.02
|
0.6
|
0.041
|
0.26
|
0.15
|
* post-layout simulations, PD (pseudo-differential delay-line), 2D (two dimensional),
TA (time amplifier), GRO (gated ring oscillator), VR (Vernier ring), RTL (resettable
T-latch).
PVT corner simulations were conducted to verify the performance variations, yet revealing
that the proposed 2D Vernier TDC provides correct operations with less than ${\pm}$8.3-%
variation of each rising edge even at the worst-case corners.
Table I summarizes and compares the performance of the proposed 2D Vernier TDC with the previously
reported state-of-the-arts. It is clearly seen that the proposed TDC can detect the
longest range of 27 meters with the timing resolution of 6 ns from a 15-bit comparator,
and consume the lowest power of 0.15 mW.
IV. CONCLUSIONS
This paper presents a modified 2-D Vernier TDC utilizing a novel resettable T-latch
for LiDAR applications, where narrow input pulses can be converted to a high-latched
outputs. Hence, the proposed 2D Vernier TDC is suitable for the detection of the reflected
pulses from targets in the long range of few hundred meters.
ACKNOWLEDGMENTS
This research was supported by the MSIT(Ministry of Science and ICT), Korea, under
the ITRC(Information Technology Research Center) support program (2018-0-01421) supervised
by the IITP(Institute for Information & communications Technology Promotion).
REFERENCES
Buchbinder E., Speed Detection: LADAR, www-ee.eng.buffalo.edu/faculty/cartwright/teaching/ee494s99/presentations/lasar.pdf.
McLeod D., Jacobson J., Hardy M., Embry C., Sep 2013, Autonomous Inspection using
an Underwater 3D LiDAR, IEEE 2013 OCEANS, pp. 1-8
Vercesi L., Fanori L., Bernardinis F. D., Liscidini A., Castello R., Sep 2018, TOF
Lidar Development in Autonomous Vehicle, IEEE Optoelectronics Global Conference, pp.
185-190
Kim et al. S. G., Nov 2013, A 1.8Gb/s/ch 10mW/ch -23dB crosstalk eight-channel transimpedance
amplifier array for LADAR systems, IEEE International SoC Design Conf., pp. 115-118
Kurtti S., Nissinen J., Kostamovaara J., Mar 2017, A Wide Dynamic Range CMOS Laser
Radar Receiver With a Time-Domain Walk Error Compensation Scheme, IEEE Trans. on Circuits
and Systems I, Vol. 64, No. 3, pp. 550-561
Zheng H., Ma R., Liu M., Zhu Z., Mar 2018, High Sensitivity and Wide Dynamic Range
Analog Front-End Circuits for Pulsed TOF 4-D Imaging LADAR Receiver, IEEE Sensors
J., Vol. 18, No. 8, pp. 3114-3124
Vornicu I., Carmona-Galan R., Rodriguez-Vazquez A., Jan 2014, A CMOS Imager for Time-of-Flight
and Photon Counting Based on Single Photon Avalanche Diodes and In-Pixel Time-to-Digital
Converters, Romanian J. of Information Science and Tech., Vol. 17, No. 4, pp. 353-371
Nissinen J., Nissinen I., Kostamovaara J., May 2009, Integrated Receiver Including
Both Receiver Channel and TDC for a Pulsed Time-of-Flight Laser Rangefinder With cm-Level
Accuracy, IEEE J. of Solid-State Circuits, Vol. 44, No. 5, pp. 1486-1497
Kurtti S., Kostamovaara J., Jan 2011, An Integrated Laser Radar Receiver Channel Utilizing
a Time-Domain Walk Error Compensation Scheme, IEEE Trans. on Instrum. and Meas., Vol.
60, No. 1, pp. 146-157
Cho H. S., Kim C. H., Lee S. G., Oct 2014, A High-Sensitivity and Low-Walk Error LADAR
Receiver for Military Application, IEEE Trans. on Circuits and Systems I, Vol. 61,
No. 10, pp. 3007-3015
Dudek P., Szczepanski S., Hatfield J. V., Jul 2000, A High-Resolution CMOS Time-to-Digital
Converter Utilizing a Vernier Delay Line, IEEE J. of Solid-State Circuits, Vol. 35,
No. 2, pp. 1626-1635
Staszewski R. B., Vemulapalli S., Vallur P., Wallberg J., Balsara P. T., Mar 2006,
1.3 V 20 ps Time-to-Digital Converter for Frequency Synthesis in 90-nm CMOS, IEEE
Trans. on Circuits and Systems II, Vol. 53, No. 3, pp. 220-224
Vercesi L., Fanori L., Bernardinis F. D., Liscidini A., Castello R., Aug 2010, Two-dimensions
Vernier time-to-digital converter, IEEE J. of Solid-State Circuits, Vol. 45, No. 8,
pp. 1504-1512
Lee M., Abidi A. A., Apr 2008, A 9b, 1.25ps Resolution Coarse–Fine Time-to-Digital
Converter in 90 nm CMOS that Amplifies a Time Residue, IEEE J. of Solid-State Circuits,
Vol. 43, No. 4, pp. 769-777
Straayer M. Z., Perrott M. H., Apr 2009, A Multi-Path Gated Ring Oscillator TDC With
First-Order Noise Shaping, IEEE J. of Solid-State Circuits, Vol. 44, No. 4, pp. 1089-1098
Yu J., Dai F. F., Jaeger R. C., Apr 2010, A 12-Bit Vernier Ring Time-to-Digital Converter
in 0.13 m CMOS Technology, IEEE J. of Solid-State Circuits, Vol. 45, No. 4, pp. 830-842
Author
Young-Min Jang received the B.S., M.S. degrees from the Department of Electronic and
Electrical Engineering, University of Ulsan, Republic of Korea, in 2012, 2014, respectively.
He is currently pursuing the Ph.D. degree at the SoC Lab. in the same university.
His research interests include integrated circuits and architectures for analog/digital
CMOS circuit designs for the applications of automotive electronics.
Ying He received the B.S. degree in Telecommunications Engineering from Yanbian University
of Science & Technology, Yanji, China, in 2012.
She is currently working toward the Ph.D. degree in the analog circuits and systems
Lab. at Ewha Womans University.
Her current research interests include integrated circuits and architectures for high-speed
CMOS analog front-end designs for optical communication systems.
Sang-Bock Cho received the B.S., M.S., and Ph.D. degrees from Hanyang University,
Seoul, Republic of Korea, in 1979, 1981, and 1985, respectively, all in electrical
engineering.
He has been with the School of Electrical Engineering, University of Ulsan, Ulsan,
Republic of Korea, since 1985.
He was with the University of Texas at Austin, Austin, TX, USA, as a Visiting Scholar
from 1994 to 1995, and the University of California at San Diego, San Diego, CA, USA,
as a Visiting Scholar from 2003 to 2004.
He is currently a Director of the Automobile/Ship Electronics Convergence Center.
His current research interests include VLSI/system-on-chip design and test, computer
vision, audio/image signal processing, automotive electronics, and multimedia applications.
Dr. Cho is a member of The Institute.
Ji-Hoon Kim received the B.S. (summa cum laude) and Ph.D. degrees in electrical engineering
and computer science from KAIST, Daejeon, South Korea, in 2004 and 2009, respectively.
In 2009, he joined Samsung Electronics. In 2018, he joined the faculty of the department
of electronic and electrical engineering, Ewha Womans University, where he is currently
an associate professor.
His current interests include CPU/DSP, communication modem, and low-power SoC design
for security/biomedical systems.
Dr. Kim is a technical committee member of the circuits and systems for communications
and VLSI systems and applications in the IEEE Circuits and Systems Society.
He was a recipient of the best design award at Dongbu HiTek IP Design Contest in 2007
and first place award at the International SoC Design Conference Chip Design Contest
in 2008.
Sung Min Park received the B.S. degree in electrical and electronic engineering from
KAIST, Korea, in 1993.
He received the M.S. degree in electrical engineering from University College London,
U.K., in 1994, and the Ph.D. degree in electrical and electronic engineering from
Imperial College London, U.K., in May 2000.
. In 2004, he joined the faculty of the Department of Electronics Engineering at Ewha
Womans University, Seoul, Korea, where he is currently a Professor.
His research interests include high-speed analog/digital integrated circuit designs
in submicron CMOS and SiGe HBT technologies for the applications of optical interconnects,
silicon photonics, and RF communications.
Prof. Park has served on the technical program committees of a number of international
conferences including ISSCC (2004–2009).