NamIlku1
LeeOckgoo1
ImDonggu2
-
(Dept. of Electrical Engineering, Pusan National University, Busan 609-735, Korea.
)
-
(Division of Electronic Engineering, Jeonbuk National University, Jollabuk-do 561-756,
Korea)
Copyright © The Institute of Electronics and Information Engineers(IEIE)
Index Terms
CMOS, front-end, harmonic rejection mixer, low noise amplifier (LNA), sub-GHz, wideband
I. INTRODUCTION
Internet of Things (IoT) has become an emerging and fast-growing heterogeneous network
that can interconnect a variety of devices, people, data, and processes for a wide
range of applications. Recently, sub-GHz low power wide area network (LPWAN) technologies
such as SigFox, long-range wide area network (LoRaWAN), narrowband IoT (NB-IoT), and
long-term evolution (LTE)-M have been introduced to ensure a long transmission range
of more than multiple kilometers with low power consumption.
The front-end circuit for sub-GHz IoT applications must be capable of handling signals
with broadband input frequencies ranging from 50 MHz to 900 MHz in order to support
multiple LPWAN technologies with a single hardware. This wideband nature of input
signals can cause the odd local oscillator (LO) harmonic mixing problem. Because the
undesired channels located at LO harmonic frequencies are aliasing into the wanted
channel and thus this directly degrades signal-to-noise ratio (SNR) of the receiver,
the harmonic rejection functionality is required absolutely for sub-GHz IoT front-end.
In addition, the front-end should provide a sufficiently high voltage gain and a low
noise figure (NF) to satisfy the stringent sensitivity requirement for various sub-GHz
IoT standards. Depending on the interference environment, it also should have high
linearity represented by input-referred IP3 and IP2 (IIP3 and IIP2) because the second-
and third-order intermodulation distortion (IMD2 and IMD3) caused by the multiple
interferers in a crowded sub-GHz spectrum can fall at the same frequency of the desired
channel.
In this paper, a low noise and highly linear wideband CMOS RF front-end is designed
for sub-GHz IoT applications. The single-ended resistive feedback LNA, the wideband
differential LNA employing thermal noise cancellation, and the in-phase and quadrature
(I/Q) harmonic rejection mixer (HRM) employing IMD3 cancellation are designed in a
0.18-μm CMOS technology.
II. CIRCUIT IMPLEMENTATION
Fig. 1 shows the block diagram of the proposed RF front-end for sub-GHz IoT applications.
The LNA is composed of the single-ended resistive feedback LNA (SLNA) and differential
noise canceling common gate (CG) LNA (DLNA). At high sensitivity mode, the SLNA is
operated as the first amplification stage of the receiver to compensate the power
loss of external wideband balun and achieve sufficiently high voltage gain. This leads
to excellent sensitivity performance of the receiver. On the other hand, for high
selectivity mode, the operation of SLNA and DLNA is dominated by IIP2 performance
because the LNA with single-ended input and output shows very poor IIP2. It was reported
in (1) that the required IIP2 of the wideband LNA exceeds more than +90 dBm without filtering
under the condition that 1.8 GHz GSM interferer and 2.4 GHz WLAN interferer generate
IMD2 in the wanted frequency of 600 MHz. Although some out-of-band (OOB) rejection
characteristic of the filter can relax the required specification, it is almost impossible
for the single-ended LNA to achieve this level of IIP2 performance.
Fig. 1. Block diagram of the proposed RF front-end for sub-GHz IoT applications.
Several linearization techniques to improve IIP2 of the single-ended LNA have been
devised in
(2-4), however, the amount of improvement is very sensitive to process, temperature, and
voltage (PVT) variations. The complex calibration circuit to compensate PVT variations
should be integrated with LNA core circuit, and this increases the hardware complexity
and power consumption of the receiver. As a result, it is desirable to adopt the fully
differential LNA having an excellent IIP2 as the first amplification stage of the
receiver at high selectivity mode. In this work, concerning for high selectivity mode,
the SLNA is powered down and it is bypassed into the DLNA without any amplification.
Namely, the DLNA becomes the first amplification stage of the receiver. One of the
concerns in this scheme is that the sensitivity degradation resulting from the additional
power loss caused by by-pass switch and external wideband balun is inevitable at the
price of high IIP2 performance. Fortunately, this is not significant because the sensitivity
specification at high selectivity mode is relaxed than high sensitivity mode. In conclusion,
by selecting the SLNA or the DLNA as the first amplification stage according to the
mode of the receiver, the stringent requirements of sensitivity and selectivity for
sub-GHz IoT receivers can be satisfied simultaneously.
For the SLNA of Fig. 2(a), the resistive feedback LNA is chosen because of its wide input impedance matching,
low NF, and reasonable voltage gain with the advantage of using no external input
matching components. For linearity, the feedback LNA provides good linearity because
the negative feedback reduces distortion components by a factor of loop gain (5). The external transformer is employed as the output load of the SLNA, and it operates
as an RF choke to provide a sufficiently high gain and ensure a good linearity. In
addition, it converts a single-ended signal into a differential signal for the DLNA.
The use of an external transformer is inevitable because it is almost impossible to
implement a broadband on-chip transformer working over the entire frequency bands
from 50 MHz to 900 MHz due to the limitation of silicon area and power loss.
Fig. 2(b) shows the proposed broadband LNA employing thermal noise cancellation based on current
amplification. By adopting the structure combining the CG amplifier (M1) with the common source (CS) amplifier (M2) thorough the current mirror, the dominant noise source from M1 is cancelled out at the LNA output. This is when total transconductance (gm1N) of the CG transistor with current amplification is equal to the transconductance
(gm2) of the CS transistor. The wideband input impedance matching (ZIN = 2/gm1) is easily obtained by the CG amplifier. In addition, the proposed LNA has relatively
high IIP3 due to current amplification, which can eliminate voltage-to-current (V-I)
conversion process resulting in nonlinearity. The adopted current mirror in this work
is on the basis of a modified current mirror configuration. In the modified current
mirror, instead of dc coupling, two current mirror transistors M3 and M4 are ac-coupled through the capacitor C2. Because the width of the transistor M4 can be increased under allowed gain bandwidth without dc current amplification, the
modified current mirror shows higher current mirror ratio N = (W/L)4/(W/L)3 with low
dc power consumption compared to conventional current mirror.
Fig. 2. (a) Schematic of the wideband single-ended LNA, (b) schematic of the wideband
noise canceling differential LNA.
Fig. 3 shows the schematic of the HRM composed of a transconductance stage, a phase-shifting
stage, and two coefficient scaling and summing stages for in-phase (I) and quadrature-phase
(Q) path. Because the linearity burden of the RF front-end lies in the down-conversion
mixer, it is important to design a highly linear wideband down-conversion HRM. In
order to improve the linearity of the mixer in wideband without additional power consumption,
the micro-mixer topology with the CG input stage employing IMD3 cancellation technique
is adopted as shown in
Fig. 3. The IMD3 current (It.3rd) of the linearized input transconductor in
Fig. 3 can be expressed as
Fig. 3. Schematic of the proposed HRM composed of a transconductance stage, a phase-shifting
stage, and two coefficient scaling and summing stages for I and Q path.
where vin is the small signal input voltage of the mixer and g
m(2) is the second derivative of the transconductance gm. In order to obtain high IIP3,
the magnitude of g
m1(2) - g
m2(2) + g
m3(2) should be minimized by choosing the proper size and dc bias of the transistors M
1, M
2, and M
3 (6).
The 45° phase-shifted multiphase LO signals drives the HRM. The four switching mixers
to generate I and Q baseband signals is used in the HRM. The phase-shifting stage
plays the role of the phase rotation of an input signal using 45° phase-shifted LO
signals as well as down-conversion through four individual switching mixers. In the
coefficient scaling and summing stage, three phase-shifted baseband signals down-converted
from RF bands are combined with weighted size ratio of 1:√2:1 through current mirror
pairs (M
20 and M
28 : M
22 and M
29 : M
24 and M
30). The coefficient scaling and summation in the baseband domain reduces the gain mismatch
compared to that in the RF domain of
(7).
III. MEASUREMENT RESULTS
The proposed RF front-end was fabricated in a 180 nm RF CMOS technology. Fig. 4 shows a photograph of the proposed RF front-end. The chip size is 1 mm x 0.7 mm,
including pads. The proposed RF front-end including LO generation circuit draws 11.6
mA for high selectivity mode and 15.6 mA for high sensitivity mode from a 1.8 V supply
voltage, respectively.
Fig. 4. Chip photograph of the proposed RF front-end.
Fig. 5 shows the simulated and measured conversion gain (A
v), input return loss (S
11), NF, IIP3, and IIP2 of the proposed RF front-end when the SLNA is activated and
bypassed, respectively. The filled and blank symbols denote the measurement and simulation
results, respectively. The simulated IIP2 result is omitted because it depends on
the amount of mismatch of the differential structure in the layout. The reported NF
is the double-sideband NF, and the two tone spacing is 1 MHz for the linearity test.
Fig. 5. Simulated and measured (a) conversion gain (Av) and input return loss (S11), (b) NF, (c) IIP3 and IIP2 of the proposed RF front-end. The filled and blank symbols
denote the measurement and simulation results, respectively. The simulated IIP2 result
is omitted because it depends on the amount of mismatch of the differential structure
in the layout.
At high sensitivity mode where the SLNA is enabled, the RF front-end shows an A
v of greater than 38 dB, a NF of less than 2.1 dB, an IIP3 of greater than -23 dBm,
and an IIP2 of greater than +15 dBm in the measurement. Concerning for high selectivity
mode where the SLNA is powered down, the RF front-end achieves an A
v of greater than 22.5 dB, a NF of less than 4.7 dB, an IIP3 of greater than –6.8 dBm,
and an IIP2 of greater than +50 dBm in the measurement. On the whole, the measurement
result is well matched to the simulation result. Compared to the simulation result,
due to a narrower bandwidth of the front-end circuit, the measured A
v slightly drops as the operating frequency increases. Because the gain of the DLNA
is not high enough to suppress the noise contribution of the following HRM, the difference
between the simulated and measured NF at high selectivity mode becomes slightly higher
than that at high sensitivity mode. In case of the measured S
11, the proposed front-end shows a S
11 of lower than -10 dB over the entire operating frequency bands.
Fig. 6 presents the measured 3rd LO harmonic rejection ratio (HRR) of the proposed front-end.
The LO signal of 250 MHz, desired input signal of 251 MHz, and undesired interferer
of 751.1 MHz were applied to the input of the receiver. Then, the fundamental component
of 1 MHz and 3rd LO harmonic mixing component of 1.1 MHz were detected for the measurement
of the 3rd LO HRR. The measured 3rd LO HRR is 57.3 dBc without any calibration. Fig. 7 shows the measured 3rd and 5th LO HRR over the operating frequency range. The front-end
circuit achieves quite high HRR performance ranging from -55 dBc to -60 dBc due to
accurate coefficient scaling and summation in the baseband domain through current
mirrors.
Fig. 6. Measured 3rd LO harmonic rejection ratio (HRR).
Fig. 7. Measured 3rd and 5th LO HRR over the operating frequency range.
In
Table 1, experimental results are summarized and compared to the traditional front-end circuits
for sub-GHz IoT receivers. The proposed front-end shows an excellent NF at high sensitivity
mode and linearity (IIP3 and IIP2) at high selectivity mode with lower power consumption
in comparison with the conventional front-end circuits.
Table 1. Performance Summary and Comparison with Traditional Front-end Circuits for
Sub-GHz IoT Receivers
|
(8)
CICC'09
|
(9)
JSSC'12
|
(10)
TCAS-I'14
|
(11)
TCAS-II'17
|
This Work
(Sensitivity)
|
This Work
(Selectivity)
|
RF Frequency (MHz)
|
54 - 862
|
30 - 2400
|
54 - 882
|
50 - 880
|
50 - 900
|
Conversion Gain (dB)
|
< 107
|
> 66
|
> 21.5
|
> 35
|
> 38
|
> 22.5
|
NFDSB (dB)
|
5 - 8.5
|
5 - 8
|
3.3 - 4.1
|
3 - 3.5
|
1.6 - 2.1
|
3.5 - 4.7
|
IIP3
(dBm)
|
-16
@ 0.8 GHz
|
-11
@ 0.6 GHz
|
-5
@ 0.8 GHz
|
-17.5
@ 0.8 GHz
|
-21
@ 0.8 GHz
|
-5
@ 0.8 GHz
|
IIP2
(dBm)
|
NA
|
+13
@ 0.6 GHz
|
+32
@ 0.8 GHz
|
NA
|
+18
@ 0.8 GHz
|
+53
@ 0.8 GHz
|
3rd LO HRR
(dB)
|
43
@ 0.9 GHz
|
43
@ 0.6 GHz
|
NA
|
52
@ 0.1 GHz
|
57
@ 0.25 GHz
|
LNA Topology
|
Single-ended
|
Single-ended
|
Differential
|
Differential
|
Single-ended
|
Differential
|
Power Consumption
(mW)
|
(1)77.4
@ 1.8 V
|
30 - 44.4 @ 1.2 V
|
(1)40.5
@ 1.5 V
|
25.2
@ 1.8 V
|
28
@ 1.8 V
|
21
@ 1.8 V
|
Process Technology
(CMOS)
|
180-nm
|
90-nm
|
130-nm
|
180-nm
|
180-nm
|
(1) Power consumption excluding multi-phase LO generation circuit
|
IV. CONCLUSIONS
A low noise and highly linear wideband RF front-end with the harmonic rejection mixer
is implemented as a part of the low power sub-GHz IoT receiver. Depending on the interference
environment, the proposed front-end supports two operation modes having high sensitivity
and selectivity performance by enabling or disabling the first building block of the
single-ended LNA. By selecting the SLNA or the DLNA as the first amplification stage
according to the mode of the receiver, the stringent requirements of sensitivity and
selectivity for sub-GHz IoT receivers can be satisfied simultaneously.
ACKNOWLEDGMENTS
This work was supported by the National Research Foundation of Korea (NRF) grant funded
by the Ministry of Science and ICT (NRF-2019R1A2C1090935), Korea and also supported
by the Institute of Information and Communications Technology Promotion (IITP) grant
funded by the Korea government (MSIT) under Grant 2018-0-01461. The chip fabrication
and EDA tool were supported by the IC Design Education Center (IDEC), Korea.
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Author
Ilku Nam received the B.S. degree in EE from Yonsei University, Korea, in 1999, and
the M.S. and Ph.D. degrees in EECS from the KAIST, Korea, in 2001 and 2005, respec-tively.
From 2005 to 2007, he was a Senior Engineer with Samsung Electronics, Gyeonggi-do,
Korea, where he was involved in the development of mobile digital TV tuner IC.
In 2007, he joined the School of Electrical Engineering, Pusan National University,
Busan, Korea, and is now a Professor.
Ockgoo Lee received the B.S. degree in electrical engineering from Sungkyunkwan University,
Korea, in 2001, the M.S. degree in electrical engineering from the KAIST, Korea, in
2005, and the Ph.D. degree in electrical and computer engineering from the Georgia
Institute of Technology, USA, in 2009.
Upon completion of the doctoral degree, he joined Qualcomm Inc., USA, as a Senior
Engineer, where he was involved in the development of transmitters and integrated
passive circuits on mobile applications.
He is currently a faculty member with the Department of Electrical Engineering, Pusan
National University, Korea.
His research interests include high-frequency integrated circuits and system design
for wireless communications and biomedical applications.
Donggu Im received the B.S., M.S., and Ph.D. degrees in electrical engineering and
computer science from the Korea Advanced Institute of Science and Technology (KAIST),
Daejeon, Korea, in 2004, 2006, and 2012, respectively.
From 2006 to 2009, he was an Associate Research Engineer with LG Electronics, Seoul,
Korea, where he was involved in the development of universal analog and digital TV
receiver ICs.
From 2012 to 2013, he was a Post-Doctoral Researcher with KAIST, where he was involved
in the development of the first RF SOI CMOS technology in Korea with SOI business
team in National NanoFab Center (NNFC), Daejeon, Korea.
In 2013, he joined the Texas Analog Center of Excellence (TxACE), Department of Electrical
Engineering, University of Texas at Dallas, as a Research Associate, where he developed
ultra-low-power CMOS radios with adaptive impedance tuning circuits.
In 2014, he joined the Division of Electronic Engineering, Jeonbuk National University,
Jeollabuk-do, Korea, and is now an Associate Professor.
His research interests are CMOS analog/RF/ mm-wave ICs and system design.