KimJong Pal1
-
(School of Mechatronics Engineering, Korea University of Technology and Education,
1600, Chungjeol-ro, Byeongcheon-myeon, Dongnam-gu, Cheonan-si, Chungcheongnam-do,
31253, Korea)
Copyright © The Institute of Electronics and Information Engineers(IEIE)
Index Terms
Pseudo-resistor, temperature, sensitivity, compensation, amplifier
I. INTRODUCTION
As a front-end amplifier for measuring a sensor signal, a capacitively coupled instrumentation
amplifier (CCIA) for voltage measurement and a transimpedance amplifier (TIA) for
current measurement are the most widely used amplifiers. Fig. 1(a) shows the structure of a CCIA with a feedback resistor R$_{f}$ to provide DC bias
to the virtual ground nodes (mp and mn) of the amplifier (A$_{c}$). Due to the feedback
resistance (R$_{f}$), CCIA has a high-pass filter characteristic and requires a large
feedback resistance for low cutoff frequencies. Harrison implemented pseudo-resistor
using MOS to realize large feedback resistance in CCIA structure (1). Fig. 1(b) shows the structure of a TIA with a feedback resistor (R$_{f}$) to provide a transimpedance
gain from the input current (II$_{in}$) to the output voltage (V$_{out}$). Chuah implemented
pseudo-resistor using MOS to realize large feedback resistance in TIA structure (2). The resistors used in these applications range from a few GΩ to a few TΩ. Since
it is impossible to implement such high-resistance resistors in an integrated circuit
using pure resistor elements, various methods for realizing a pseudo-resistance using
a MOS have been introduced (3).
Fig. 1. Applications requiring pseudo-resistors (a) capacitively coupled amplifier
and high pass filter characteristics, (b) transimpedance amplifier for current measurement.
Fig. 2. Pseudo-resistor implementation approaches and characteristics (a) passive
pseudo-resistor, (b) active pseudo-resistor, (c) detailed structure of active pseudo-resistor,
(d) temperature dependency of passive pseudo-resistor, (e) temperature dependency
of active pseudo-resistor.
Types of pseudo-resistors can be divided into passive pseudo-resistors and active
pseudo-resistors. The passive pseudo-resistor has only two terminals (t1 and t2) corresponding
to the two terminals of the resistor, as shown in Fig. 2(a), and no additional power-consumed circuit is required. On the other hand, the active
pseudo-resistor has a voltage bias terminal (V$_{b}$) added, as shown in Fig. 2(b), and additional power-consumed circuit is required to generate the voltage bias (V$_{b}$).
An example of an active pseudo-resistor structure and circuit for generating the bias
voltage is shown in Fig. 2(c). When sensor readout circuits are used for industrial products, it must satisfy the
specifications for the industrial temperature range of -40 ℃ to 85 ℃. Naturally, the
pseudo-resistor must also satisfy the industrial temperature specification. Fig. 2(d) shows the temperature dependence of a passive pseudo-resistor, which has a logarithmic
scale variability with respect to temperature variation. In the case of the active
pseudo-resistor in Fig. 2(c), the temperature sensitivity is significantly improved compared to the passive pseudo-resistor,
but it shows resistance variability of several hundred percent with respect to temperature
change. In order for the pseudo-resistor to be used in industrial sensing circuits,
the large temperature dependence of the pseudo-resistor must be improved. For this
reason, in this paper, a novel pseudo-resistor with improved temperature dependence
is proposed.
Section II describes the circuit and operation principle of the newly proposed pseudo-resistor.
Section III summarizes the simulation results for the performance of the proposed
pseudo-resistor, and Section V concludes.
II. CIRCUIT DESCRIPTION
Fig. 3(a) shows the circuit structure of the proposed pseudo-resistor. The pseudo-resistor
consists of two PMOSs (MP$_{1}$ and MP$_{2}$) and an offset voltage generator (VOFF_GEN).
The two PMOSs are symmetrically connected in series and have a potential V$_{mp}$
at a common node. The body bias of each PMOS is all connected to the common node.
The VOFF_GEN block receives the voltage V$_{mp}$ from the common node and generates
a gate voltage V$_{gp}$ commonly provided to both PMOSs (MP$_{1}$ and MP$_{2}$). The
resistance value of the pseudo-resistor can be controlled by adjusting the amount
of current flowing through the pseudo-resistor. The current flowing through the pseudo-resistor
can be adjusted by controlling the difference voltage (V$_{sg}$ = V$_{mp}$ - V$_{gp}$)
between the gate and source of the PMOSs. The VOFF_GEN controls the voltage difference
(V$_{sg}$) between the gate and source of the PMOSs. The VOFF_GEN generates the output
voltage (V$_{gp}$) by inputting temperature and the voltage (V$_{mp}$) at the common
node.
Fig. 3. Detail Circuit structures of (a) pseudo-resistor, (b) offset voltage generator
(VOFF_GEN), (c) biasn generator (BIASN_GEN).
Fig. 3(b) shows the detailed structure of the offset generator (VOFF_GEN). The VOFF_GEN
is a level shifter (or source follower) composed of one NMOS (MN$_{LS}$) and a current
source (II$_{LS}$). The output V$_{gp}$ is generated by being downshifted from the
input V$_{mp}$ by the threshold value (V$_{thn}$) of the NMOS (MN$_{LS}$) and current
value (II$_{LS}$). The output V$_{gp}$ can be expressed as
in which $\mu_{n}$ is the electron mobility, $C_{o x}$ is the capacitance density
of the gate oxide, and $(L / W)_{M N_{L S}}$ is the ratio of gate length to width
of MN$_{LS}$. The threshold voltages of the PMOSs (MP$_{1}$ and MP$_{2}$) of $R_p$
and the NMOS (MN$_{LS}$) of VOFF_GEN change according to the temperature change, and
as a result, the pseudo-resistance value also changes. The pseudo resistance value
change due to temperature change is compensated by the bias current II$_{LS}$. Therefore,
the current (II$_{LS}$) must have temperature sensitivity, and the temperature sensitivity
must be controllable. The current in the current source (II$_{LS}$) can be tuned by
a current control bias (biasn).
Fig. 3(c) shows the detailed structure of the bias generator (BIASN_GEN). The current
control bias generation block (BIASN_GEN) produces a control voltage (biasn) used
for current control in VOFF_GEN. The current generated by the control voltage (biasn)
is proportional to the absolute temperature (PTAT). The PTAT current is generated
using parasitic pnp transistors (Q1$_{1}$ and Q1$_{2}$) and resistors (RR). At nodes
NL and NR, the currents and voltages are held at the same value ($i_{L}$ = $i_{R}$,
V$_{L}$ = V$_{R}$) by the PMOSs (MP$_{3}$ and MP$_{4}$) and the error amplifier (Ae).
The emitter voltages (V$_{e1}$ and V$_{R}$) of Q1$_{1}$ and Q1$_{2}$ decrease with
increasing temperature. When a voltage having a CTAT(Complementary to absolute temperature)
characteristics is applied across the resistor (RR), the current flowing through the
resistor (RR) has a PTAT characteristics. The sensitivity to temperature of the PTAT
current ($i_{L}$, $i_{R}$) can be adjusted by changing the resistance value (RR).
The PTAT current flowing through RR is copied to MN$_{5}$, and the magnitude of the
current is scaled to the required level. Eventually, a current controlled bias (biasn)
is created in the NMOS (MN$_{3}$).
III. Simulation Results
The layout of the proposed pseudo-resistor and bias blocks is shown in Fig. 4 with an overall size of 190 µm x 150 µm.
Fig. 5 shows the characteristics of the proposed pseudo-resistor according to the
temperature variation from – 40 ℃ to 85 ℃. Fig. 5(a) shows the bias current (II$_{LS}$) in VOFF_GEN according to the temperature variation.
PTAT current plots with various slopes and levels can be obtained by adjusting the
control registers (REG_RR for RR and REG_P for MN$_{5}$) in Fig. 3(c). Fig. 5(b) shows the change in resistance value according to temperature change at various resistance
values. Table 1 summarizes the pseudo-resistance change level with respect to temperature change.
For a temperature variation of 125 °C from -40 °C to +85 °C, the pseudo-resistance
value has a minimum variation of 1.1 % and a maximum of 2.1 %. Temperature sensitivity
(S$_{T}$) can be defined as the rate of change of resistance (RT) for a unit temperature
change, and the rate of change of resistance can also be calculated by dividing the
maximum variation in resistance ($_{\left(\Delta R_{p}\right)}$) by the median resistance
value ($_{\left(\Delta R_{p,mid}\right)}$) as in Eq. (2).
Fig. 4. Layout of the proposed pseudo-resistor and bias blocks.
Fig. 5. Characteristics of the proposed pseudo-resistor according to the temperature
variation (a) PTAT current used in VOFF_GEN, (b) resistance of pseudo-resistor.
Table 1. Resistance value variation of pseudo-resistor ($R_p$) in temperature range(-40℃
~ 85℃)
$R_p$
|
$R_{p,mid}$
[GΩ]
|
$R_{p,max}$
[GΩ]
|
$R_{p,min}$
[GΩ]
|
$\Delta R_{p}$
[%]
|
ST
[ppm/℃]
|
Case1
|
10.5
|
10.63
|
10.41
|
2.1
|
168
|
Case2
|
5.6
|
5.62
|
5.53
|
1.6
|
128
|
Case3
|
3.8
|
3.78
|
3.74
|
1.1
|
91
|
Case4
|
2.9
|
2.91
|
2.87
|
1.2
|
94
|
Case5
|
2.3
|
2.36
|
2.32
|
1.5
|
120
|
Case6
|
2.0
|
2.00
|
1.97
|
1.4
|
113
|
Case7
|
1.7
|
1.73
|
1.71
|
1.2
|
93
|
Table 2. Performance summary and comparison
|
This work
|
Djekic (4)
|
Process technology
|
0.18 µm CMOS
|
0.18 µm CMOS SOI
|
Supply voltage
|
1.8 V
|
1.8 V
|
Power consumption
|
4 uW
|
200 uW
|
Resistance
|
1.7 GΩ ~ 10.4 GΩ
|
10 MΩ ~ 100 MΩ
|
Resistance variation
|
2.1 %
|
15 %
|
Temperature range
|
-40 ~ 85 ℃
|
-40 ~ 125 ℃
|
Temperature sensitivity
|
91 ppm/℃
~ 168 ppm/℃
|
900 ppm/℃
|
For various resistance values from 1.7 GΩ to 10.5 GΩ of pseudo-resistance, the temperature
sensitivity has a minimum of 91 ppm/℃ and a maximum of 168 ppm/℃. These results show
that the pseudo-resistance maintains a very stable resistance value over a temperature
change range of 125 ℃.
Table 1 summarizes the performance indices of the proposed pseudo resistance and compares
them with the latest previous work. Compared to previous work, the performance of
this paper is superior in terms of temperature sensitivity and power consumption.
IV. CONCLUSIONS
A novel pseudo-resistor insensitive to temperature change is proposed. The pseudo-resistor
is implemented using two PMOSs connected in series and an offset generator (VOFF_GEN)
between the gate and source of the PMOSs. The resistance value and temperature sensitivity
are controlled by adjusting the voltage difference (V$_{gs}$) between the gate and
the source of the PMOS generated by VOFF_GEN. The voltage difference (V$_{gs}$) is
generated by the PTAT current (II$_{LS}$), and the magnitude and temperature sensitivity
of the PTAT current can be controlled. By adjusting the magnitude of the PTAT current,
the pseudo-resistance value could be obtained from 1.7 GΩ to 10.4 GΩ. In addition,
by tuning the resistor (RR) that controls the temperature sensitivity of the PTAT
current (II$_{LS}$), the temperature sensitivity (S$_{T}$) of the pseudo-resistor
was able to obtain a minimum value of 91 ppm/℃ in the range of -40 ℃ to 85 ℃. The
proposed pseudo-resistor can be used in many applications with a wide temperature
range by being mounted on a charge amplifier and a transimpedance amplifier.
ACKNOWLEDGMENTS
This work was supported by the National Research Foundation of Korea (NRF) grant funded
by the Korea government (MSIT) (No. 2020R1F1A1067128). This paper was supported by
the new professor research program of KOREATECH in 2020
REFERENCES
Harrison R., , June, 2003, A Low-Power Low-Noise CMOS Amplifier for Neural Recording
Applications, Solid-State Circuits, IEEE Journal of, Vol. 38, No. 6, pp. 958-965
Chuah J.H., Oct., 2015, Design of Low-Noise High-Gain CMOS Transimpedance Amplifier
for Intelligent Sensing of Secondary Electrons, IEEE Sensors Journal, Vol. 15, Vol.
15, No. 10, pp. 5997-6004
Sharma K., June, 2021, MOS based pseudo-resistors exhibiting Tera Ohms of Incremental
Resistance for biomedical applications: Analysis and proof of concept, INTEGRAION,
the VLSI journal, Vol. 76, pp. 25-39
Djekic D., Nov., 2017, A Transimpedance Amplifier Using a Widely Tunable PVT-Independent
Pseudo-Resistor for High-Performance Current Sensing Applications, 43rd IEEE European
Solid State Circuits Conference(ESSCIRC), 2017, 11-14, pp. 79-82
Author
received his B.S. degree in mechanical design from the Department of Mechanical Design,
Chung-Ang University, Seoul, Korea, M.S. degree in mechanical engi-neering from KAIST,
Daejon, Korea, and Ph.D. degrees in electrical engineering and computer science from
Seoul National University, Seoul, Korea, in 1995, 1997, and 2003, respectively.
He was a member of research staff at Samsung Advanced Institute of Technology (SAIT)
from 2001 to 2019.
In 2020, he joined the Faculty of School of Mechatronics Engineering, Korea University
of Technology and Education, Cheonan, Korea.
His research interests include low power and low noise analog integrated circuits
for biomedical and MEMS applications.