JungHoyong1
JeonNeungin1
CheonJimin1
JangYoung-Chan1
-
(Department of Electronic Engineering, Kumoh National Institute of Technology, Gumi,
Gyungbuk, Korea)
Copyright © The Institute of Electronics and Information Engineers(IEIE)
Index Terms
Successive approximation register, noise shaping, analog-to-digital converter, differential capacitor, voltage gain calibration
I. INTRODUCTION
Smart devices require small area and low-power analog-to-digital converters (ADCs)
to acquire information such as temperature, pressure, and Earth’s magnetic field.
In addition, the resolution of ADCs required in sensor interfaces continues to increase.
Delta-sigma ADCs have been widely used for high-resolution sensor interfaces. However,
since they generally use analog integrators with operational amplifiers, the power
consumption and area are relatively large [1-3]. Furthermore, the high oversampling ratio used in the delta-sigma modulator increases
the frequency of the sampling clock and the complexity of the decimation filter.
On the other hand, a successive approximation register (SAR) ADC has advantages of
low power consumption and small area. However, it has difficulty in increasing the
resolution due to the area and mismatch of the digital-to-analog converter (DAC) [4-6]. As an alternative to the limitation of improving the resolution of SAR ADCs, SAR
ADCs using noise shaping (NS) are being studied [7-9]. Passive integrators can be used for noise shaping without increasing power consumption
[7,8]. In this case, the capacitor for the passive integrator increases the area of the
NS SAR ADC. In addition, the comparator for the operation of the NS SAR ADC is designed
to receive and compare multiple input signals rather than a single input. For the
stability and performance of the NS SAR ADC, it is required that the comparator has
an optimal voltage gain for the output of the passive integrator.
In this paper, a NS SAR ADC that increases resolution by applying second-order noise
shaping in a 10-bit SAR ADC is proposed. In particular, the use of a capacitor-resistor
hybrid DAC (C-R DAC) for operation of SAR ADC and two differential capacitors for
second-order noise shaping is proposed to minimize the area of the NS SAR ADC [10-12]. Furthermore, voltage gain calibration for a three-input comparator is proposed for
stable noise shaping and evaluated from the measurement results of the NS SAR ADC.
Section II presents the behavioral model and simulation results for the design of
the second-order NS SAR ADC. Section III explains the operation including the block
and timing diagrams of the proposed NS SAR ADC. It describes a design technique to
minimize the area of the NS SAR ADC and a three-input comparator with voltage gain
calibration for second noise shaping. Section IV presents the implementation and measurement
results of the NS SAR ADC. Finally, Section V provides the conclusion of this paper.
II. BEHAVIORAL MODEL OF SECOND-ORDER NOISE SHAPING SAR ADC
Fig. 1 shows the conceptual block diagram of the proposed second-order NS SAR ADC. The proposed
second-order NS SAR ADC basically has an architecture in which a second-order integrator
is added to a 10-bit SAR ADC. The SAR ADC is simply represent by using a 1-bit quantizer,
a SAR logic, and a DAC, and outputs a 10-bit binary digital code as the result of
the NS SAR ADC. H(z) is a second-order integrator for noise shaping. The second-order
NS SAR ADC is different from a general SAR ADC in the two way: 1) H(z) outputs V$_{\mathrm{INT1}}$(z)
and V$_{\mathrm{INT2}}$ by integrating V$_{\mathrm{RES}}$(z), which is the residue
voltage after quantization of the SAR ADC. 2) V$_{\mathrm{RES}}$(z) is summed with
V$_{\mathrm{INT1}}$(z) and V$_{\mathrm{INT2}}$(z), and the summed analog signal, V$_{\mathrm{QIN}}$(z),
is converted to a 10-bit digital code by the operation of the SAR ADC.
Fig. 1. Conceptual block diagram of NS SAR ADC: (a) NS SAR ADC; (b) second-order integrator.
The behavioral model of the second-order integrator, H(z) is shown in Fig. 1(b). Part A and Part B are blocks for the first and second integration, respectively.
In this work, the second-order integrator is implemented by using passive filters
consisting only of capacitors and switches without amplifiers. a1 is the coefficients
for voltage reduction due to charge sharing between the C-R DAC of the SAR ADC and
the sampling capacitor of the integrator. In addition, b1 and b2, and c1 and c2 are
coefficients for voltage reduction due to charge sharing between the sampling capacitor
of the integrator and the capacitors of the first and second integrators, respectively.
The outputs of the two integrators, V$_{\mathrm{INT1}}$ and V$_{\mathrm{INT2}}$, are
defined as Eqs. (1) and (2), respectively, when a1, b1, b2, c1, and c2 are 3/4, 1/4, 3/4, 1/4, and 3/4, respectively.
The output of the proposed NS SAR ADC, D$_{\mathrm{OUT}}$(z), is derived as Eq. (3) by the behavioral block diagram shown in Fig. 1(a), where the voltage gains of the comparator for V$_{\mathrm{INT1}}$ and V$_{\mathrm{INT2}}$,
k$_{1}$ and k$_{2}$, are set to 4 and 16 for the stable NTF, respectively [13]. Eq. (3) is simply expressed as Eq. (4) by using Eqs. (1) and (2) for the V$_{\mathrm{INT1}}$ and V$_{\mathrm{INT2}}$. Therefore, the analog input
signal V$_{\mathrm{IN}}$(z) is directly transferred to the output of the NS SAR ADC,
and the quantization noise E(z) is shaped by the noise transfer function (NTF) shown
in Eq. (5).
Fig. 2 shows the behavioral simulation results of the NTF. The NTF of the designed NS SAR
ADC has the characteristics of a high-pass filter in which the voltage gain decreases
in the low-frequency region and increases as the frequency increases. Through such
shaping of quantization noise, it is possible to increase the signal-to-noise ratio
(SNR) of data conversion for an analog input signal with low frequency.
Fig. 2. Behavioral simulation result of NTF.
Fig. 3(a) shows the behavioral model of the proposed second-order NS SAR ADC based on a 10-bit
SAR ADC using the MATLAB Simulink. It consists of a 1-bit quantizer, a SAR logic with
DAC, and a second-order integrator are implemented by components supporting the MATLAB
Simulink. This behavioral model does not include non-ideal components of the NS SAR
ADC. The analog input of the second-order NS SAR ADC is sampled through the process
A. The process B shows that the reference voltage for the operation of the 10-bit
SAR ADC, which is generated by the SAR logic and the DAC with a 9-bit resolution,
is supplied to the 1-bit quantizer. In the process C, the residue voltage, V$_{\mathrm{RES}}$,
is generated after the conversion of the 10-bit SAR ADC, and is sampled for the integration
operation. It is determined by the difference between the sampled input voltage and
the output voltage of the 10-bit DAC including the information of the least significant
bit of the 10-bit SAR ADC for the noise shaping operation, although the 10-bit SAR
ADC requires the reference voltages generated by the 9-bit DAC, as shown in Fig. 3(b). The second-order integrator supplies the integrated residue voltage to the 1-bit
quantizer in the process D. The 1-bit quantizer compares the sum of the sampled input
and the two integrated residue voltages against a reference that changes sequentially
9 times for operation of the 10-bit SAR ADC. The 1-bit quantizer operates in synchronization
with the signal of COMP_CLK.
Fig. 3. (a) Behavioral model of proposed NS SAR ADC; (b) residue voltage for noise shaping.
Fig. 4 shows the behavioral model of the SAR logic with DAC. The SAR logic with DAC is implemented
by using a Chart in the Stateflow library of the MATLAB Simulink which can implement
a control logic with finite state machine. Bit is a variable representing the number
of SAR conversions of 10 times, and DAC_OUT is the output of the 9-bit DAC. The value
of Bit is from 1 to 10 for 10-bit SAR operation, and its initial value is 1. Since
the analog input range of the proposed second-order NS SAR ADC is 0 V to 1.8 V, the
initial value of DAC_OUT is set to 0.9 V, which is the center voltage. The SAR logic
with DAC is synchronized with the signal of COMP_CLK and operates according to the
result of the 1-bit quantizer, COMP_OUT. If the value of Bit is less than 10, the
signal STROBE indicating the completion of the SAR operation is maintained low, and
whenever the signal COMP_CLK goes high, the value of Bit is increased by 1. In this
process, the 9-bit DAC outputs the reference voltage as the value of DAC_OUT by the
successive approximation algorithm. When the value of Bit is 10, the signal STROBE
goes high, and DAC_OUT is sampled as the residue value for integration of noise shaping
by the signal STROBE. After that, Bit and DAC_OUT are initialized.
Fig. 4. Behavioral model of SAR logic with DAC.
Fig. 5 shows the fast Fourier transform (FFT) results of the behavior simulations of the
10-bit SAR ADC and the proposed second-order NS SAR ADC. The 10-bit SAR ADC has effective
number of bits (ENOBs) of 9.97 bits when the frequency of the analog input signal
is 16.259 kHz and the sample rate is 1 MHz, as shown in Fig. 5(a). Fig. 5(b) is the FFT simulation result of the proposed second-order NS SAR ADC using the 10-bit
SAR ADC. When the analog input frequency and the sample rate are the same as in the
previous case and the over-sampling ratio (OSR) is 8, the ENOB of the proposed NS
SAR ADC is determined to be 14.26 bits. Through these behavioral simulations, it is
confirmed that ENOB of about 4.3 bits is improved through proposed noise shaping using
the second integrator.
Fig. 5. Behavioral simulation results: (a) 10-bit SAR ADC; (b) proposed second-order NS SAR ADC.
III. DESIGN OF SECOND-ORDER NOISE SHAPING SAR ADC
1. Architecture and Operation of NS SAR ADC
Fig. 6 shows the block and timing diagrams of the proposed second-order NS SAR ADC. The
second-order NS SAR ADC consists of a 10-bit digital-to-analog-converter (DAC), integration
capacitors for noise shaping, a three-input comparator, and a SAR logic including
gain calibration, as shown in Fig. 6(a). Its OSR and input bandwidth are 8 and 62.5 kHz. The three-input comparator generates
the signal COMP_OUT by differentially comparing the sum of the three results, the
result of the 10-bit DAC and the outputs of the first and second integrators. The
10-bit DAC has a C-R DAC architecture, which consists of an 8-bit capacitor DAC and
a 2-bit resistor DAC. The C-R DAC can reduce the chip area compared with a DAC using
only capacitors. In addition, the use of the C-R DAC can decrease the capacitor values
used in the passive integrator for noise shaping because the capacitor value used
in the passive integrator is determined proportional to the total capacitor value
of the C-R DAC generating the residue voltage. The noise shaping is performed by using
passive integrators, which consists of two C$_{\mathrm{RES}}$s, one C$_{\mathrm{INT1}}$,
and one C$_{\mathrm{INT2}}$. C$_{\mathrm{INT1}}$ and C$_{\mathrm{INT2}}$ are used
as differential capacitors to reduce the increase in chip area due to noise shaping
using a passive integrator. The two C$_{\mathrm{RES}}$s are used to perform the sampling
operation for the residue voltage of the 10-bit DAC. The first and second integrations
are performed by C$_{\mathrm{INT1}}$ and C$_{\mathrm{INT2}}$, respectively, sequentially
sharing charges with C$_{\mathrm{RES}}$.
Fig. 6. Proposed NS SAR ADC: (a) block diagram; (b) timing diagram.
The proposed second-order NS SAR ADC operates in synchronization with the external
clock EXCLK with a frequency of 17 MHz. It samples the input analog signal during
the high region of the first cycle of EXCLK after the signal RSTB goes high, as shown
in Fig. 6(b). After that, the SAR data conversion proceeds in synchronization with the rising
edge of COMP_CLK, which is the comparator operation clock. The output of the second-order
NS SAR ADC, D[9:0], is sequentially output in synchronization with the falling edge
of COMP_CLK. The least significant bit, D[0], is decided by voting from D$_{0}$[2],
D$_{0}$[1], and D$_{0}$[0] as a results of three comparisons for the same output of
the 10-bit DAC to remove the dynamic noise of the comparator. For noise shaping, the
residue voltage generated in the 10-bit DAC by the 10-bit SAR conversion is sampled
in C$_{\mathrm{RES}}$ by the signal NS_SAMPLE. The first integrator generates an output
by sharing charges between C$_{\mathrm{RES}}$ and C$_{\mathrm{INT1}}$ when the signal
NS1 is high. After the first integration, the output of the second integrator is generated
as C$_{\mathrm{RES}}$ again shares charges with C$_{\mathrm{INT2}}$, as shown in Fig. 6(a).
Table 1shows the total capacitors used for the implementation of a 10-bit SAR ADC and noise
shaping, and explains the size of the capacitor reduced by the C-R DAC and differential
capacitor used in this work. C is the value of the unit capacitor used in the NS SAR
ADC. For operation of 10-bit SAR analog-to-digital conversion ADC and generation of
residue voltage, a differential capacitor DAC using a V$_{\mathrm{CM}}$-based switching
scheme is implemented by using 2048${\cdot}$C. In addition, C$_{\mathrm{RES}}$, C$_{\mathrm{INT1}}$,
and C$_{\mathrm{INT2}}$ are determined to be 1/3${\cdot}$C$_{\mathrm{DAC}}$, 1${\cdot}$C$_{\mathrm{DAC}}$,
and 1${\cdot}$C$_{\mathrm{DAC}}$, respectively, to implement the coefficients $\textit{a1,
b1, b2}$, $\textit{c1}$, and $\textit{c2}$ of the passive integrators shown in Fig. 1(b) as 3/4, 1/4, 3/4, 1/4, and 3/4. Thus, the design method reported in the prior literature
[13] requires a total capacitor of 6826.6${\cdot}$C to implement the second-order NS SAR
ADC while the SAR ADC has a resolution of 10 bits. A 10-bit C-R DAC with a 2-bit resistor
DAC can reduce the capacitor size to 1/4 that of a 10-bit CDAC. Furthermore, the use
of differential capacitors C$_{\mathrm{INT1}}$ and C$_{\mathrm{INT2}}$ for integration
halves the number and value of capacitors, so that C$_{\mathrm{INT1}}$ and C$_{\mathrm{INT2}}$
can be determined to be 1/4 of the size of the conventional integrator capacitors.
The proposed second-order NS SAR ADC uses 938.6${\cdot}$C by using the C-R DAC and
the two differential capacitors. Therefore, it has a capacitor area reduced by 86.25%
compared to the conventional NS SAR ADC.
Table 1. Size comparison of capacitors used in second-order NS SAR ADC.
2. Second-order Integrator
Fig. 7 shows the circuit and operation of the second-order integrator used in the proposed
second-order NS SAR ADC. First, after the 10-bit SAR conversion is completed, the
generated residual voltage is stored in the C-R DAC, as shown in Fig. 7(a), where C$_{\mathrm{DACP/M}}$ is a total capacitor in the differential C-R DAC. In
this mode, both C$_{\mathrm{RES}}$s are discharged. In the second process shown in
Fig. 7(b), the residual voltage of C$_{\mathrm{DACP/M}}$, V$_{\mathrm{RES}}$(k), is sampled
as a new voltage through charge sharing with the two C$_{\mathrm{RES}}$s when the
signal NS_SAMPLE is activated. In this process, the value of V$_{\mathrm{NS \_ S}}$(k)
is determined by Eq. (6). Fig. 7(c) shows the process of the first integration. When the signal NS1 is activated, the
charge for V$_{\mathrm{NS \_ S}}$(k) sampled in C$_{\mathrm{RES}}$ is shared with
C$_{\mathrm{INT1}}$. V$_{\mathrm{INT1}}$(k) for the first noise shaping is expressed
by Eq. (7). The second integration is shown in Fig. 7(d). If the signal NS2 is activated after the first integration, the charge of the residual
voltage stored in C$_{\mathrm{RES}}$ is shared with C$_{\mathrm{INT2}}$. Thus, V$_{\mathrm{INT2}}$(k)
is determined by Eq. (8) for the second noise shaping. The integrated voltages V$_{\mathrm{INT1}}$(k) and
V$_{\mathrm{INT2}}$(k) are supplied to inputs of the three-input comparator.
Fig. 7. Second-order integrator: (a) generation of residue voltage; (b) sample of residue voltage; (c) first integration; (b) second integration.
3. Three-input Comparator with Voltage Gain Calibration
In the behavioral simulation of Section II, the voltage gains of the comparator for
V$_{\mathrm{INT1}}$ and V$_{\mathrm{INT2}}$, k$_{1}$ and k$_{2}$, were set to 4 and
16, respectively. Variations of k$_{1}$ and k$_{2}$ values cause degradation of the
performance of the NS SAR ADC. Fig. 8 shows the behavioral simulation results for the performance of the NS SAR ADC according
to the voltage gain of the comparator with three inputs. When k$_{2}$ is 16, the NS
SAR ADC has a stable ENOB when k$_{1}$ is set to a value greater than 3 and less than
5. When k$_{1}$ is set to 4, k$_{2}$ is required to have values between 10 and 22.
Thus, in this work, the voltage gain for the three-input comparator is calibrated
for optimum performance of the NS SAR ADC.
Fig. 8. Behavioral simulation results of NS SAR ADC according to k$_{1}$ and k$_{2}$: (a) when k$_{2}$ = 16; (b) when k$_{1}$ = 4.
Through the behavioral simulation for the maximum performance of the proposed NS SAR
ADC, the voltage gain of the three-input comparator for the three input signals (the
result of the 10-bit DAC, the output of the first integrator and the output of the
second integrator) is determined to be 1:4:16. Fig. 9 describes the conceptual operation of the proposed voltage gain calibration for the
three-input comparator. The voltage gain for the output of the first integrator in
the three-input comparator should be four times that for the output signal of the
10-bit DAC. As the first step, the 10-bit DAC generates V$_{\mathrm{RES}}$ through
the fixed digital codes CP[9:0] and CM[9:0]. After that, V$_{\mathrm{RES}}$ is converted
to a voltage of V$_{\mathrm{RES}}$/4 through the sampling process to C$_{\mathrm{RES}}$
and charge sharing between C$_{\mathrm{RES}}$ and C$_{\mathrm{INT1}}$. And the converted
differential V$_{\mathrm{RES}}$ /4 is supplied to INTP1 and INTM1 of the three-input
comparator, as shown in Fig. 9(a). In the second step, the 10-bit DAC is supplied with a digital code opposite to that
of the first step as shown in Fig. 9(b). Then, it generates a V$_{\mathrm{RES}}$ for INP and INM with opposite polarity to
the value of V$_{\mathrm{RES}}$/4 generated for INTP1 and INTM1. In this condition,
the voltage gain of the three-input comparator is adjusted so that the values of ``INP-INM''
and ``INP1-INM1'' are equal, and as a result, the voltage gain of the input terminal
for the output of the first integrator is calibrated to 4. In this case, both the
nodes INP2 and INM2 remain V$_{\mathrm{CM}}$. The voltage gain calibration of the
three-input comparator for the output of the second integrator is almost the same
as the method shown in Fig. 9, but instead of V$_{\mathrm{RES}}$/4, V$_{\mathrm{RES}}$/16 is supplied to INP2 and
INM2. For this, charge sharing is additionally performed using both C$_{\mathrm{INT1}}$
and C$_{\mathrm{INT2}}$ in the process shown in Fig. 9(a).
Fig. 9. Proposed voltage gain calibration of 3-input comparator for output of first integrator: (a) generation of V$_{\mathrm{RES}}$/4; (b) voltage gain control.
Fig. 10 shows the circuit diagram of three-input comparator with voltage gain calibration.
When the gains of the input stage are expressed as G1, G2, G3, and G4, the output
voltage of the three-input comparator is determined as G4 ${\times}$ (INP ${-}$ INM)
+ G3 ${\times}$ (G2 ${\times}$ (INTP2 ${-}$ INTM2) + G1 ${\times}$ (INTP1 ${-}$ INTM1)).
When the ratios of G4 to G3 and G1 to G2 are 1:2 and 2:8, respectively, the ratio
of k$_{1}$ and k$_{2}$ is determined to be 4:16. The proposed voltage gain calibration
for the three-input comparator is performed by controlling the ratio of G1 and G2.
G1 and G2 are each controlled by changing the width of the input transistors through
the control of a 3-bit digital code. Fig. 11 shows the simulated values of k$_{1}$ and k$_{2}$ of the designed three-input comparator
including a constant-gm bias circuit according to process, voltage, and temperature
(PVT) variations. According to the results of Fig. 11, the calibration ranges of k$_{1}$ and k$_{2}$ were designed to be 1.68 to 6.15 and
7.30 to 22.87, respectively, according to the post-layout simulation results using
HSPICE.
Fig. 10. Circuit diagram of three-input comparator.
Fig. 11. Simulated k$_{1}$ and k$_{2}$ of three-input comparator according to PVT variations.
IV. CHIP IMPLEMENTATION AND MEASUREMENT RESULTS
The proposed second-order NS SAR ADC was implemented by using a 180-nm 1-poly 5-metal
CMOS process with a supply voltage of 1.8 V. Its active area is 470 ${\mu}$m ${\times}$
350 ${\mu}$m, as shown in Fig. 12. The CMOS process used in this work supports the minimum value of the capacitor used
as the unit capacitor C as 18 fF. Thus, the reduction of the active area of the proposed
NS SAR ADC was limited due to the area for the implementation of the capacitors although
the use of the C-R DAC and differential integral capacitors. The power consumption
of the second-order NS SAR ADC with an input voltage range of full rail-to-rail is
248 ${\mu}$W when it operates at a sampling rate of 1 MHz and has an OSR of 8.
Fig. 13 show the measured static performances of the 10-bit SAR ADC when the implemented
second-order NS SAR operates without noise shaping. The differential nonlinearity
(DNL) and integral nonlinearity (INL) are +0.19/${-}$0.20 LSBs and +0.26/${-}$0.24
LSBs, respectively, and both values are within +/${-}$0.5 LSBs. The spikes in the
measured DNL and INL are considered to be caused by mismatch between capacitors in
the C-R DAC. Fig. 14 shows the measured dynamic performances of the 10-bit SAR ADC through the FFT of
the results of the second-order NS SAR. The measured signal-to-noise and distortion
ratio (SNDR) and ENOB are 58.82 dB and 9.48 bits, respectively, when the 10-bit SAR
ADC operates at a sampling rate of 1 MHz for a differential analog input signal with
low frequency of 16.259 kHz.
Fig. 12. Chip photograph of implemented second-order NS SAR ADC.
Fig. 13. Measured static performances of 10-bit SAR ADC: (a) DNL; (b) INL.
Fig. 14. Measured dynamic performances of 10-bit SAR ADC.
Fig. 15 shows the measured dynamic performances of the implemented second-order NS SAR, including
the effect of the proposed voltage gain calibration for the comparator with three
inputs. The proposed second-order noise shaping reduced the noise floor by about 20
dB in the low-frequency region compared to the noise floor of the 10-bit SAR ADC shown
in Fig. 14. In addition, it moved the quantization noise from the low-frequency region to the
high-frequency region. When the implemented second-order NS SAR ADC with an OSR of
8 operates in the initial state without the proposed voltage gain calibration for
the three-input comparator, the measured SNDR and ENOB are 78.82 dB and 12.80 bits,
respectively, as shown in Fig. 15(a). Fig. 15(b) shows the improved dynamic performance by applying the proposed voltage gain calibration
for the three-input comparator. The SNDR and ENOB are measured to be 80.18 dB and
13.03 bits.
Fig. 15. Measured dynamic performances of second-order NS SAR ADC: (a) w/o calibration; (b) w/ calibration.
Fig. 16 shows the measured SNDR of the proposed second-order NS SAR as the voltage gains
of the three-input comparator, k$_{1}$ and k$_{2}$, are varied within the designed
range. The implemented second-order NS ADC has optimal SNDR characteristics when the
proposed voltage gain calibration is applied rather than when the voltage gains of
the comparator are controlled by external control (Case1, 2, 4, and 5). Fig. 17 shows the measured SNDR of the proposed second-order NS SAR ADC according to the
amplitude of the analog input signal with a frequency of 16.259 kHz.
Fig. 16. Measured SNDR of second-order NS SAR ADC according to voltage gains of comparator (k$_{1}$, and k$_{2}$).
Fig. 17. Measured SNDR of second-order NS SAR ADC according to amplitude of input signal.
Table 2 shows the performance comparison of NS SAR ADCs. The proposed second-order NS ADC
has an ENOB of 13 bits or more while it has an OSR of 8.
Table 2. Performance comparison of NS SAR ADCs
V. CONCLUSIONS
The proposed second-order NS SAR ADC with the passive integrators was designed by
using a 180-nm CMOS process with a supply voltage of 1.8 V. The C-R DAC and two differential
integrals were used to reduce the active area. Furthermore, the proposed voltage gain
calibration for the three-input comparator maximized the dynamic performance of the
second NS SAR ADC. The second noise shaping applied to the 10-bit SAR ADC improved
a SNDR of 21.36 dB, equivalent to an ENOB of 3.55. Thus, the proposed second-order
NS SAR ADC had a SNDR of 80.18 dB and an ENOB of 13.03 bits for an analog input signal
with a voltage range of full rail-to-rail and with a frequency of 16.259 kHz while
it has an OSR of 8 and a sampling rate of 1 MHz. Its area and power consumption were
0.165 mm$^{2}$ and 248 ${\mu}$W, respectively.
ACKNOWLEDGMENTS
This work was supported by the Basic Science Research Program (2020R1I1A3071634)
and Priority Research Centers Program (2018R1A6A1A03024003) through the NRF funded
by the Ministry of Education, and the Grand Information Technology Research Center
Program (IITP-2022-2020-0-01612) through the IITP funded by the MSIT, Korea. The EDA
tool was supported by the IC Design Education Center, Korea.
References
Liu C.-C., Huang M-C., Feb. 2017, A 0.46mW 5MHz-BW 79.7dB-SNDR Noise-Shaping SAR ADC
with Dynamic-Amplifier-Based FIR-IIR Filter, IEEE International Solid-State Circuits
Conference, pp. 466-467
Li S., Qiao B., Gandara M., Pan D. Z., Sun N., Dec. 2018, A 13-ENOB second-order noise-shaping
SAR ADC realizing optimized NTF zeros using the error-feedback structure, IEEE Journal
of Solid-State Circuits, Vol. 53, No. 12, pp. 3484-3496
Karmakar S., Gònen B., Sebastiano F., Van Veldhoven R., Makinwa K. A. A., Dec. 2018,
A 280 μW dynamic-zoom ADC with 120 dB DR and 118 dB SNDR in 1 kHz BW, IEEE Journal
of Solid-State Circuits, Vol. 53, No. 12, pp. 3497-3507
Shu Y.-S., Kuo L.-T., Lo T.-Y., Dec. 2016, An oversampling SAR ADC with DAC mismatch
error shaping achieving 105 dB SFDR and 101 dB SNDR over 1 kHz BW in 55 nm CMOS, IEEE
Journal of Solid-State Circuits, Vol. 51, No. 12, pp. 2928-2940
Miyahara M., Matsuzawa A., Apr. 2017, An 84 dB dynamic range 62.5-625 kHz bandwidth
clock-scalable noise-shaping SAR ADC with open-loop integrator using dynamic amplifier,
IEEE Custom Integrated Circuits Conference, pp. 1-4
Akbari M., Honarparvar M., Savaria Y., Sawan M., Oct. 2020, OTA-free MASH 2-2 noise
shaping SAR ADC: System and design considera-tions, 2020 IEEE International Symposium
on Circuits and Systems, pp. 1-5
Zhang Q., Ning N., Li J., Yu Q., Wu K., Zhang Z., Jan. 2020, A Second-Order Noise-Shaping
SAR ADC Using Two Passive Integrators Separated by the Comparator, IEEE Transactions
on Very Large Scale Integration Systems, Vol. 29, No. 1, pp. 227-231
Lin Y.-Z., Lin C.-Y., Tsou S.-C., Tsai C.-H., Lu C.-H., Feb. 2019, A 40MHz-BW 320MS/s
Passive Noise-Shaping SAR ADC with Passive Signal-Residue Summation in 14nm FinFET,
IEEE International Solid-State Circuits Conference, pp. 330-332
Shiet L., Zhang Y., Wang Y., Kareppagoudr M., Sadollahi M., Temes G. C., Aug. 2018,
A 13b-ENOB noise shaping SAR ADC with a two-capacitor DAC, International Midwest Symposium
on Circuits and Systems, pp. 153-156
Jung H., Jeon N., Jang Y.-C., Oct. 2021, Second-order Noise Shaping SAR ADC using
3-input Comparator with Voltage Gain Calibration, International SoC Design Conference,
pp. 123-124
Jung H., Dec. 2020, Study on Second-order Noise Shaping SAR ADC, Master Degee, Kumoh
National Institute od Technology
Park J., Nagaraj K., Ash M., Kumar A., Apr. 2017, A 12-/14-bit, 4/2MSPS, 0.085 mm2
SAR ADC in 65nm using novel residue boosting, IEEE Custom Integrated Circuits Conference,
pp. 2152-3630
Guo W., Zhuang H., Sun N., Jun. 2017, A 13b-ENOB 173dB-FoM 2 nd-order NS SAR ADC with
passive integrators, IEEE Symposium on VLSI Circuits, pp. c236-C237
Hsu C.-K., Tang X., Liu J., Xu R., Zhao W., Mukherjee A., Andeen T. R., Sun N., Mar.
2021, A 77.1-dB-SNDR 6.25-MHz-BW pipeline SAR ADC with enhanced interstage gain error
shaping and quantization noise shaping, IEEE Journal of Solid-State Circuits, Vol.
56, No. 3, pp. 739-740
Zhang Q., Li J., Zhang Z., Wu K., Ning N., Yu Q., Ari. 2021, A 13b-ENOB third-order
noise-shaping SAR ADC using a hybrid error-control structure, IEEE Custom Integrated
Circuits Conference, pp. 1-2
Hoyong Jung was born in Busan, South Korea, in 1994. He received the B.S. and M.S.
degrees from the Department of Electronic Engi-neering, Kumoh National Institute of
Technology, Gumi, South Korea, in 2019 and 2021, respectively, where he is currently
pursuing the Ph.D. degree. His current research interests include the design of data
converters.
Neung-in Jeon was born in Ulsan, South Korea, in 1996. He received the B.S. degrees
in the department of electronic engineering from Silla University, Busan, Korea, in
2021. He is currently pursuing the M.S. degrees in the Department of Electronic Engineering,
Kumoh National Institute of Technology, Gumi, South Korea. His current research interests
include the design of data converters.
Jimin Cheon received the B.S., M.S., and Ph.D. degrees in electrical and electronic
engineering from Yonsei University, Seoul, South Korea, in 2003, 2005, and 2010, respectively.
From 2010 to 2012, he was a Senior Engineer in the Image Development Team of System
LSI Division, Samsung Electronics, Yongin, South Korea, working on the design of APS-C
CMOS image sensors for mirrorless and DSLR cameras. From 2012 to 2013, he was a Manager
in the Semiconductor Tech. Laboratory of Fusion Technology Research and Development
Center, SK Telecom, Seongnam, South Korea, working on the design of automotive CMOS
image sensors with SK hynix. In 2013, he joined the School of Electronic Engineering,
Kumoh National Institute of Technology, Gumi, Korea, as a Faculty Member. His current
research area is the design of CMOS image sensors, low-power data converters, high
performance sensors, and interface circuits.
Young-Chan Jang received the B.S. degree in the department of elec¬tronic engineering
from Kyungpook National University, Daegu, Korea, in 1999 and the M.S. and Ph.D. degrees
in electronic engineering from Pohang University of Science and Technology (POSTECH),
Pohang, Korea, in 2001 and 2005, respectively. From 2005 to 2009, he was a Senior
Engineer in the Memory Division, Samsung Electronics, Hwasung, Korea, working on high-speed
interface circuit design and next-generation DRAM. In 2009, he joined the School of
Electronic Engineering, Kumoh National Institute of Technology, Gumi, Korea, as a
Faculty Member, where he is currently Professor. His current research area is high-performance
mixed-mode circuit design for VLSI systems such as high-performance signaling, clock
generation, and analog-to-digital conversion.