SeoByeong Jae1
JungGu2
JungSunghun3
SeolDong-Min3
ChungSungmoon4
EoYun Seong1,2
-
(Department of Electronic Engineering at Kwangwoon University, Seoul, 139-701, Korea)
-
(Silicon R&D Corp. Seongnam-si, Gyeonggi-do, 13510, Korea)
-
(C4I R&D Center, LIG Nex1 Company, Seongnam-si, Gyeonggi-do, 13510, Korea)
-
(Defense Industry Technology Center, Agency of Defense Development, Daejon-si, Chungcheong
nam-do, 13510, Korea
)
Copyright © The Institute of Electronics and Information Engineers(IEIE)
Index Terms
Ultra-wideband, CMOS, radar, through-the-wall, equivalent time sampling, time interleaved sampling
I. INTRODUCTION
Through-the-wall radar (TWR) for the detection of human being or moving object behind
the wall has been paid attentions both in military and commercial safety applications.
Especially, the ultra-wideband (UWB) radar is the mostly used for the TWR due to its
fine range resolution and good penetration characteristics through the various walls
[1-7]. The cm-level resolution allows us to distinguish the human existence easily using
the information of body movement and breathing. During the military tactical or human
rescue operations, the small size and light weight are the important requirements
of the portable TWR equipment for the efficient and safe mission in the various severe
environments. Up to now, although many developments of TWR are published, few literatures
have been presented, which deal with the small form factor and light weight TWR using
the highly integrated radar IC [6,7]. Comparing with the existing hybrid radar module, the integrated UWB radar IC greatly
reduces the number of the hybrid components and discrete MMICs on the PCB board and
makes it possible to implement the small size and light weight radar transceiver board.
Moreover, the UWB radar IC based radar consumes the smaller power than the hybrid
one, enabling the longer operation time and lower weight battery.
In the view point of the penetration and propagation loss, sub-GHz UWB radar has the
smaller path loss including the penetration loss so that the longer detection range
through the wall can be obtained. In this paper, a TWR sensor with the highly integrated
UWB radar IC is presented. The chosen UWB frequency band ranges from 0.9 to 1.5 GHz
for the lower path loss and better penetration characteristics.
The digitally synthesized impulse generator for the transmitter and the equivalent
time sampling receiver are adopted as in Fig. 1 [10,11]. For the resolution enhancement, the time-interleaved sampling is employed using
the four parallel sampling channels, and the sampling clock for each channel is generated
from the two cascaded delay locked loop (DLL) consisting of the coarse and fine clock
blocks. The finally achieved timing resolution is 200 ps, which corresponds to the
3 cm range resolution. For calculating the overall link budget for the TWR, the signal
attenuation through the wall is experimentally measured with the CW signal and the
well-known antenna in priori. While depending on the wall material and thickness,
the measured penetration loss through the concrete brick wall is about 15 dB. The
radar performance is demonstrated with the radar signal processing part, which utilizes
the moving target indication (MTI) and envelope detection algorithms. This paper presents
the radar IC and module mainly, and also the through-wall human detection results
with the aid of the basic signal processing part.
Fig. 1. Block diagram of UWB TWR radar IC.
II. UWB RADAR TRANSCEIVER IC DESIGN
1. UWB Radar Transceiver Architecture
Fig. 1 shows a simplified block diagram of the UWB radar transceiver which is composed of
a transmitter, 4-channel receiver, and two cascaded DLLs for the sampling clock generation.
The digitally controlled UWB impulse generator transmits the periodical UWB impulse
waveforms, and then the receiver accepts the echo signal which has the round-trip
time to the target. The received echo signal coming from the target is amplified by
RF front-end amplifier stage and then splitted into the time- interleaved 4-channel
analog signal processing (ASP) arrays via the active RF power splitter. In order to
obtain the fast sampling rate for the high resolution, the receiver adopts both the
equivalent time sampling (ETS) and the time-interleaved sampling techniques, whereas
at each ASP channel the received signal is sampled with 0.2 ns interleaved clocks
provided by the fine-bin DLL. Fig. 2 demonstrates how the virtually high speed sampling is achieved using ETS technique
combined with the interleaved architecture. The pulse repetition time is 100 ns and
the 125 times recursive samplings are done with the time shift of 0.8 ns for every
sample. The clocks C1 - C125 of 0.8 ns interval are generated in the coarse-bin DLL,
and in turn, four clocks F1 - F4 of 0.2 ns interval are also provided by the fine-bin
DLL using Ck for 4 each channel.
For the mitigation of the DC offset noise in the ASP, which is amplified and usually
saturates the ASP circuits, the 8-bit digital-to-analog converter (DAC) based DC offset
calibration is used. Each receiver channel has a high-speed track-and-hold (T/H) circuit,
an integrator, a sample-and-hold (S&H) circuit, and data-combining analog multiplexer
(MUX) in the order. Moreover, not shown in Fig. 1, to compensate for the severe through-wall loss, the additional external PA and LNA
are added for the radar gain enhancement.
Fig. 2. 4-channel time interleaved equivalent time sampling diagram.
2. High Resolution Radar Receiver Design
The RF front-end of the receiver consists of a LNA, 2-stage RF variable gain amplifier
(RF VGA), an active power splitter, and track/hold circuit array for each channel.
A noise cancelling common-gate common-source (CGCS) amplifier is used as the LNA both
to obtain the wideband gain-noise matching and the single to differential signal conversion,
as shown in Fig. 3. Since CS and CG paths have the amplitude and phase mismatches, the capacitive cross
coupled structure is also adopted to reduce the mismatch and improve the noise figure.
The Fig. 4(a) and (b) show the circuit schematics of the RF VGA and the 4-way (or channel) RF power
splitter amplifier, respectively. The 2-stage RF VGA consists of two cascode amplifiers
with the shunt CMOS transistor switch (M$_{5}$ and M$_{6}$) at the differential drain
nodes of common source transistors for controlling the gain and enhance the linearity
of the radar receiver. The simulated gain of the RF front end from LNA to RF VGA ranges
from 16.9 dB to 37 dB at 1.2 GHz (center frequency), and the simulated NF are 3.0
and 8.6 dB for max and min gain conditions, respectively.
The amplified RF signal is equally splitted into 4 channels by the 4-way power splitter
amplifier. The RF power splitter is a cascode amplifier with the four common gate
transistor pairs (M$_{3}$ and M$_{4}$) for each ASP channel. The full gain and NF
of the RF front end including LNA, VGA, and splitter, are 37 dB and 4.0 dB at 1.2
GHz, respectively. With the simple resistor load R$_{\mathrm{D}}$, the simulated 3
dB bandwidth is exceeding about 1.8 GHz. The fast time-varying UWB signal divided
by the RF splitter is tracked and held at the T/H circuit, and amplified by the analog
buffer amplifier and succeeding integrator. Fig. 5 shows the circuit schematic of the high-speed T/H circuit. The first stage of the
track and hold circuit employs the shunt peaking load to extend the gain-bandwidth
product. The T/H core adopts the switch source-follower structure, which allows the
good linearity and the tracking bandwidth. The fast current path switching easily
provides the high-speed sampling and holding performance. The required sampling clocks
for each channel (track, hold, and sample) are generated by F1-F4 clocks coming from
the fine-bin DLL [10].
The sampling clocks for 4-channels have the 200 ps time interval between the neighboring
channels and the period of 800 ps. In order to realize the averaging and smoothing
of the sampled signal, a conventional active RC integrator is employed in the radar
receiver. During the averaging period, the clock number for the transmitter is not
changed and the repeated sampling at the same time bin is performed. Hence the recursive
sampled voltage is productively integrated so that the signal to noise ratio (SNR)
is linearly improved by the number of repeated sampling times. The integration time
is usually 25 us (250 integration times) and controlled by the external digital processing
part. Also with the tuning of RC value of the integrator, the integrator gain can
be variable from -9 dB to 45 dB. The DC gain of ASP is so large in the integrator
that the amplified DC offset would be detrimental at the ASP output. Hence, 8-bit
DAC is used for DC-offset correction at the input stage of analog integrator and controlled
also by the digital part. The input-referred DC offset calibration range is up to
120 mV. At the final stage of ASP, the low speed S/H circuit and buffer amplifier
is employed, and the integrated data is acquired and transferred to the external ADC
included in the digital processing part. The DC offset mismatch between the 4-channel
is compensated by individual optimization of DAC value for each channel. And addressed
to the gain mismatch, the 1-dB step gain control in the integrator stage with the
tunable resistor calibrates the gain of each channel and mitigates the effect of channel
mismatch. The compensation with DAC and gain control is performed and optimized manually
with the radar control S/W via SPI setting.
Fig. 3. Noise cancelling common-gate common-source LNA.
Fig. 4. Circuit schematic of (a) RF VGA; (b) RF power splitter.
Fig. 5. Circuit schematic of high speed T/H.
3. Radar Sampling Clock Generation using DLL
As shown in Fig. 6, in order to realize the equivalently high speed sampling or ETS, two cascaded DLLs
are adopted as the timing clock generation circuit, which is locked to an external
10 MHz crystal oscillator [10]. Hence the pulse repetition interval (PRI) is 100 ns and the maximum detection range
with no ambiguity is 15 m. Each DLL is composed of a voltage-controlled delay line
(VCDL) cells, phase frequency detector and charge-pump with start-up circuit. The
coarse-bin (CB) DLL generates 125 bin clocks (C1 - C125) with 0.8 ns interval. One
of them is chosen by the bin selection MUX and used for triggering the digital impulse
generator. The fine-bin (FB) DLL generates the four clocks (F1 - F4) with 0.2 ns time
intervals, where C124 and C125 from the CB DLL are used as the reference clock and
comparing clock, respectively. The generated four timing clocks from the FB DLL are
fed to the individual T/H sampler of the four receiver channels, resulting in 0.2
ns equivalent sampling time resolution and 3 cm range resolution.
Fig. 6. Circuit schematic of high speed T/H.
4. UWB Waveform Generator
In contrast to the VCO based impulse generator, a digital pulse generator is employed
due to its smaller chip size, the wider tunable range of the center frequency, and
the lower power consumption [10,11]. Fig. 7 shows the simplified block diagram of the proposed pulse generator. The pulse generator
consists of the variable time delay cells, D-flip/flop unit pulse generator array,
a pulse combiner and shaper, and a final driver amplifier. The variable delay cell
is an inverter, whose time delay is changed by controlling the current source. While
the array of the delay cells provides the successively time delayed clocks to D-F/F
array, the outputs from two neighboring D-F/F are injected into EX-OR and the unit
pulse of duration ${\tau}$ is generated.
The center frequency is determined as 0.5${\tau}$, and the number of combined pulses
decides the frequency bandwidth. Therefore, the center frequency and bandwidth are
tunable by controlling the delay time and number of pulses. Considering the clock
jitter noise, the source clock D(0) is coming from the DLL. If we assume that the
jitter is 50 ps, the spectrum may be blurred about 500 kHz at 1 GHz center frequency,
which doesn’t matter in respect of the target detection and spectrum regulation.
In order to minimize the side-lobes in frequency spectrum, a pulse shaping method
is realized by the different and symmetrical amplifier gains in the pulse combiner
stage, which enables the filtering and shaping of the UWB waveform without off chip
filter component. And the spectrum change of the transmitter due to process and supply
voltage changes are also scrutinized in the simulation. Fig. 8 shows the transmitter spectrum for each process condition (slow/typical/fast), and
about 5 dB sidelobe magnitude change is observed also with the slight center frequency
shift.
Fig. 7. Digitally synthesized impulse generator and output waveform.}
Fig. 8. Tx spectrum change due to process variation.}
III. MEASUREMENT RESULTS
The UWB radar transceiver chip is fabricated in a 0.13 ${\mu}$m CMOS technology. The
die area of the radar IC occupies the area of 8.58 mm$^{2}$. In Fig. 9, the photos of the radar IC and the radar module are presented. The TWR radar IC
can dramatically minimize the number of external components and reduces the size of
the radar sensor module for the light weight TWR equipment. Fig. 10(b) shows the measured power spectrum of the impulse transmitter of UWB radar IC, where
the center-frequency is 1.19 GHz with 600 MHz bandwidth at 10~MHz PRF (Pulse Repetition
Frequency).
The time-domain waveform of the transmitted impulse is also shown in Fig. 10(a). The receiver RF front end part of the radar IC, which includes the LNA to the RF
power splitter, is measured with the additional RF output port.
As shown in Fig. 11, the gain and noise figure of the receiver RF front end part are 35.3 dB and 3.2
dB at 1.2 GHz, respectively. To suppress the many commercial interferers around 900
MHz, a RF notch filter using L and C passives is realized at the RF receiver path
on the test board, so that the gain curve abruptly goes down near the 900 MHz range.
The current consumption of the full radar IC is 116.3 mA from 1.2 V supply.
To enhance the transmitter power and receiver sensitivity by the compensation of the
through-wall loss, the final radar module as shown in Fig. 9 employs the external power amplifier and low noise amplifier, whose gains are about
20 dB and 15 dB, respectively. In the actual through-wall radar experiment, it is
necessary to separate people behind the wall from the clutters and background noise
because many environmental reflectors other than the human target are detected during
the measurement. For this reason, the moving target indication (MTI) processing is
useful for emphasizing the motion and discriminating the human target from the background
clutters. Fig. 12 shows the measured and processed results of the detection for the people beyond the
wall at the distance of 5.2 m and 9.4 m, respectively. By applying the simple MTI
algorithm and extracting the signal envelope, a human can be detected up to 9.4 m
beyond the two 24 cm-thick concrete brick wall. The final summary and comparison of
the through wall radars are shown in Table 1.
Fig. 9. Photos of TWR radar IC and sensor module.
Fig. 10. Measured impulse waveform and power spectrum.
Fig. 11. Measured gain and NF of receiver RF front end.
Fig. 12. Measured waveform of through wall radar with signal processing.
Table 1. Comparison of UWB TWRs and UWB radar SoCs
Ref.
|
Band
|
Transceiver
|
Application
|
Detection range
(wall type, human)
|
Resolution
|
DC power
|
CMOS Tech.
|
[1]
|
3 / 9 GHz
(BW 1GHz)
|
Discrete Module
|
TWR
|
> 2 m
(drywall panel)
|
1.5 cm
(100 ps)
|
N/A
|
-
|
[3]
|
3 – 5 GHz
|
Commercial Module
|
TWR
|
~ 2.3 m
(concrete wall)
|
6.5 cm
|
(Time Domain P220)
|
-
|
[6]
|
3 - 5 GHz
|
Radar SoC
|
TWR
|
> 3.5 m
(concrete wall)
|
1.5 cm
|
115 mW
(SoC)
|
130 nm CMOS
|
[8]
|
0.8 – 5 GHz
(BW 2.5 GHz)
|
Radar SoC
|
Human feature
|
N/A
|
0.73 cm
|
695 mW
(SoC)
|
130 nm CMOS
|
[10]
|
6.6 – 8 GHz
|
Radar SoC
|
Breathing
|
9 m
|
4.2 mm
|
118 mW
(SoC)
|
55 nm CMOS
|
This work
|
0.9 – 1.5 GHz
|
Radar SoC
|
TWR
|
> 9.4 m
(with PA, LNA)
|
3 cm
(200 ps)
|
139 mW
(SoC)
|
130 nm CMOS
|
IV. CONCLUSION
A 0.9 – 1.5 GHz UWB radar IC and sensor module for the through-wall detection of human
is presented in this paper. In order to enhance the SNR and resolution, the ETS and
time-interleaved sampling technologies are used with the embedded timing circuit (DLL).
The DC offset cancellation circuit using 8-bit DAC improves the dynamic range of the
receiver while preventing from the analog output saturation. The through-wall radar
demonstration with the help of digital signal processing is performed for the human
behind the concrete brick wall, and the maximum tracking distance is up to 9.4 m.
ACKNOWLEDGMENTS
The authors gratefully acknowledge the financial support provided by Defense Acquisition
Program Administration and Defense Industry Technology Center under the contract UD160005D
and also by the Research Grant of Kwangwoon University in 2022.
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Byeong Jae Seo received the B.S., M.S. degrees in Electronics Engi-neering from
Kwangwoon University, Korea, in 2017, 2019 respectively. Currently, he is working
toward the Ph.D. degree at KwangWoon Univer-sity. His research interests include CMOS
RF/analog IC design for wireless communication system and UWB radar transceivers.
Gu Jung received the B.S. degree in electromagnetic-wave engineering from Kwangwoon
University, Korea, in 2008. Since 2011, he joined Silicon R&D inc. as a CMOS RFIC
desinger. His research interest includes CMOS RF/analog IC design for various radars
and communication systems.
Sunghun Jung received the B.S. degree in electronics engineering from Myongji University,
Yongin, South Korea, and the M.S. degrees in electrical and electronic engineering
from Yonsei University, Seoul, South Korea, in 2012. He is currently a research engineer
with the EW R&D Center, LIG Nex1. His research interests include RF system and positioning
systems.
Dong-Min Seol. received the B.S. degree in electronics engineering from Soongsil
University in 2005. He received the M.S. and Ph.D. degrees in broadband network engineering
from University of Science and Technology in 2011. He is currently a Research Engineer
LIG Nex1. His research interests include indoor positioning, through-wall radar and
wireless communications.
Sungmoon Chung. received the B.S., M.S. and Ph.D. degrees in electronic computer
communication engi-neering from Hanyang University in 2012. He is currently a researcher
engineer with the Defense Industry Technology Center, ADD(Agency for Defense Development).
His research interests include 5G/6G, WSNs, SDN, Radar systems.
Yun Seong Eo received the B.S., M.S., and Ph. D degrees in Electrical Engineering
all from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea,
in 1993, 1995 and 2001, respectively. From 2000 to 2002, he had been with LG Electronics
Institute of Technology, Seoul, Korea, where he was involved in designing RF integrated
circuit (RFICs) such as VCO, LNA, and PA using InGaP HBT devices. In September 2002,
he joined Samsung Advanced Institute of Technology, Yongin, Korea, where he developed
5-GHz CMOS PA and RF transceivers for 802.11n target, and was also involved in the
development of 900 MHz RF identification (RFID) and 2.4-GHz ZigBee RF transceivers.
In September 2005, he joined Kwangwoon University, Seoul, Korea, where he is currently
a professor with Electronics Engineering department. Recently, he has developed so
many RF transceiver ICs for the WPAN/WBAN and narrow band IoT devices. And he has
been focusing on CMOS UWB and FMCW Radar ICs for surveillance system and proximity
fusing. In 2009, he founded Silicon R&D Inc, where he is CEO and develops CMOS based
UWB radar ICs and low power/low rate communication RFICs.