II. CIRCUIT AND PERFORMANCE
Fig. 1 shows the schematic of the divide-by-2 divider unit circuit proposed in this paper.
To get a stable division action immune from variations in the load impedance, and
promote harmonic generation at large bias, a pair of inverting buffers is inserted
in the feedback path of the PMOS cross-coupled flip-flop.
Fig. 1. Unit divide-by-2 divider circuit diagram with digital logic sequences. (a)
Device size and sub-block function and (b) timing sequence.
The basic divide-by-2 divider circuit operates as an independent circuit when the
load impedance connected to the output is sufficiently large, but if the output impedance
is not large enough, the output current supplied from the output terminal is not sufficient,
and the states of the MOSFETs (MN1, MN2) at the input terminal cannot be reversed.
Therefore, a pair of inverting buffers are added as shown in Fig. 1, which can supply enough current to invert the states of MN1 and MN2 by using feedback
to ensure stable operation even at low load impedance. A divide-by-2 divider-unit
circuit is created by adding the inverting buffer pair connected to the CMOS cascode
with MP5-MN5 and MP6-MN6 to the output terminal of the basic divide-by-2 divider circuit.
Since the output voltages are inverted by the inverting buffers, the feedback input
terminals are connected in the opposite way compared to a typical divide-by-2 divider
circuit.
The sequences 1, 2, 3, and 4 in Fig. 2 describe the detailed circuit behavior during clock transitions. The sequential digital-logic
timing analysis, as indicated inside the bracket ( ) positioned at the bottom of the
common nodes in Fig. 1.(b), is confirmed by the timing simulation in Fig. 2.
Fig. 2. Simulated timing diagram of the basic divide by 2 divider circuit.
In sequence 1, when ${\rm CLK}=1$ and ${\rm CLKB}=0$, MN7 is conducted and MN8 is
blocked. At this time, since ${\rm D}=1$ and ${\rm DB}=0$, MN1 conducts and MN2 is
blocked, and thus MP1 is blocked and MP2 is conducts, resulting in the gate voltages
MP1Gate and MP2Gate of MP1 and MP2 staying in state 1 with ${\rm MP1Gate}=1$ and ${\rm
MP2Gate}=0$, respectively.
In sequence 2, when CLK and CLKB are toggled from state 1, MN7 is blocked and MN8
is conducting, resulting in a logic state of ${\rm D}=0$, ${\rm DB}=1$. Therefore,
MN1 is blocked, MN2 is conducting, and then MP1 is blocked and MP2 are conducting,
resulting in state 2 with ${\rm MP1Gate}=1$ and ${\rm MP2Gate}=0$.
In sequence 3, when CLK and CLKB are toggled from the state 2, MN7 conducts and MN8
is blocked, but D and DB maintain the logic state in 2. MN1 and MN2 also maintain
their previous states, but since MN7 has been changed to a conducting state, it becomes
the state 3 with ${\rm MP1Gate}=0$ and ${\rm MP2Gate}=1$.
In sequence 4, when CLK and CLKB toggle from state 3, MN7 is blocked and MN8 conducts,
causing MN3 to conduct due to MP2Ggate=1. As a result, ${\rm DB}=0$, and MP4 conducts,
setting ${\rm D}=1$. With ${\rm MP2Gate}=1$, MN3 continues to conduct. Therefore,
MN1 conducts while MN2 is blocked, resulting in state 4 with ${\rm MP1Gate}=0$ and
${\rm MP2Gate}=1$.
Additionally, if CLK remains in a low voltage state for a long time, the logic state
will collapse due to leakage current.
The circuit works as a divide-by-2 divider circuit when the DC supply voltage is less
than 1.6 V.
Six divide-by-2 divider-unit circuits are connected in cascade to realize a divide-by-64
divider as shown in Fig. 3. To obtain a differential input signal in the first unit divider, an inverting buffer
used as a balun is added to the input stage.
The divider circuit is designed based on a 65nm CMOS process without using an inductor,
resulting in a compact core area of 64 $\mu$m by 13 $\mu$m. The overall area including
the pads is 200 $\mu$m by 240 $\mu$m, as shown in Fig. 4.
Fig. 3. Divider circuit consisting of an inverting buffer and 6 cascade connected
unit divide-by-2 dividers.
Fig. 4. Microphotograph with pad name of the divider circuit.
The oscilloscope output of the frequency divider circuit operating in digital logic
mode was presented in Fig. 5 for a low VDD condition. The experimental conditions are summarized in Table 1. The digital logic signals measured for input frequencies ranging from 1 MHz to 1000
MHz are shown. In Fig. 5(d), as the input signal frequency exceeds the oscilloscope's measurement range, only
the output signal is displayed. As the input signal frequency increases, the divider
shows a tendency to require higher power consumption. When the VDD surpasses a certain
threshold, the frequency divider stops operating in digital logic mode and transitions
to operation as an Injection-Locked Frequency Divider (ILFD).
Fig. 5. Output of Divider circuit operating by digital logic.
Table 1. Performance of Divider circuit operating by digital logic in Fig. 5.
|
(a)
|
(b)
|
(c)
|
(d)
|
Input Frequency
[MHz]
|
1
|
100
|
400
|
1000
|
PIN [dBm]
|
-13.05
|
-2.7
|
1.1
|
3.1
|
Division Ratio
|
64
|
Output Frequency
[MHz]
|
0.0156
|
1.563
|
6.25
|
15.63
|
PDC [μW]
|
0.48
|
14.42
|
66.6
|
151.6
|
VDD [V]
|
0.532
|
0.754
|
1.03
|
1.193
|
Considering the feedback of the output `D' and `DB' of the circuit in Fig. 1, each circuit connected to MN1-MN3-MN5 and MN2-MN4-MN6 has a structure in which an
odd number of inverters are repeated. As a result, a ring oscillator structure connected
to three inverters is formed separately, as shown in Fig. 6.
Fig. 6. Feedback ring oscillator circuit with closed loop.
The logic threshold voltage VLT of the CMOS inverter circuit is expressed as [7]
,
where $V_{TN}$ is the threshold voltage of the NMOS, $V_{TP}$ is the threshold voltage
of the PMOS, and $\beta_{N}$ and $\beta_{P}$ are the gain coefficients of the NMOS
and PMOS, respectively. $\beta_{N}$ and $\beta_{P}$ are defined in terms of mobilities
and oxide capacitances for corresponding materials as follows:
In the inverter circuit, the propagation delay time $T_{PAVG}$ related to the power
supply voltage $V_{DD}$ and load capacitor $C_{L}$ is given by
In practical applications, since $V_{DD}$ is much larger than $V_{LT}$, $V_{TN}$ and
$V_{TP}$, $T_{PAVG}$ can be simplified to
As VDD increases, $T_{PAVG}$ at each stage decreases and the non-linear characteristics
of the circuit increase, approaching the high-frequency oscillation condition. When
the oscillation condition is satisfied, the feedback path in Fig. 5 operates as a ring oscillator and a divider circuit. It operates as an ILFD in which
the frequency of the input signal is equal to the harmonics or subharmonics of the
oscillation frequency [5,6,9].
A large bias voltage increases the voltage swing at the drain and enhances the circuit
nonlinearities [8]. The DC supply voltage is divided by the 2-cascode connected MOSFETs of the inserted
inverter, which facilitates the generation of harmonic power as the DC supply voltage
increases because the other circuits operating on the same power supply are 3-cascode
connected.
As the DC supply voltage increases, a ring oscillator is formed through the feedback
path such that the output oscillates at a frequency that satisfies the Barkhausen
oscillation condition.
From (5), the oscillation frequency can be simply approximated as follows and is consequently
linearly proportional to the supply voltage VDD
The fabricated die was tested for its RF characteristics on a 50 ohm-based printed
board test fixture with 0.8 mil gold ball bonds. When the DC supply voltage is less
than 1.6 V, the complete circuit operates as a divide-by-64 divider exactly obeying
sequential digital logics up to 9 GHz. When the DC supply voltage is low, there is
a negligible tiny output power in the absence of any input signal. As the voltage
approaches 2 V, the circuit enters a state of multi-frequency self-oscillation. At
this time, when a large signal is applied at the input, a series of large harmonic
powers are generated by the balanced mixer composed of the differential pairs MN1-MN2
and MN3-MN4 [9] and the nonlinearity-enhanced inverters MN5-MP5 and MN6-MP6 [7].
In each unit oscillator circuit, the oscillation frequency is inversely proportional
to the load resistance and capacitance of the output stage, such that the locking
frequency of the oscillator circuit changes as the DC supply voltage changes. As the
DC supply voltage increases, a mixed state occurs in which the oscillation characteristics,
digital sequential logic division characteristics, and nonlinear harmonic generating
characteristics of each unit divider circuit with different impedances interact with
each other. As a result, the frequency range of operation as an ILFD is distributed
over a series of discontinuous frequency bands with different division ratios.
Table 2 lists the characteristics of the ILFD measured between 2.4 GHz and 27.1 GHz. As the
DC supply voltage changes, the ILFD operates in a frequency bandwidth smaller than
2.088 GHz around 2.4 GHz, 4.4 GHz, 6.2 GHz, 12.6 GHz, 19.1 GHz, 21.6 GHz, 24.7 GHz,
and 27.1 GHz. Each band has a unique frequency division ratio ranging from 48 to 528
depending on the supply voltage as shown in Figs. 7 and 8.
Fig. 9 shows the output waveform measured in the ILFD mode featuring a 528-division ratio
for an input signal of 27.1128 GHz and 3.15 dBm. Inset Fig. 9(a) shows the very sharp jitter characteristics measured in a narrow span of 10 kHz.
In Fig. 9(b), the phase noise is -102.23 dBc at 100 kHz offset in its resolution bandwidth. The
difference between the fundamental and the second harmonic is measured to be -5.83
dBc.
Table 3 compares the division ratio, the locking range, the power consumption, and the operating
frequency with the figure of merits (FoM) [10] for previously reported CMOS dividers for higher than K-band. Other research teams
have reported only on the ILFD characteristics with single frequency bands generated
from single-stage circuits. However, the present paper, which features a multi-stage
architecture, reports on the measurement and characterization of multiple frequency
bands. In doing so, this paper demonstrates the existence of a unique synergetic
operation between the multi-stage ILFD and divider circuits inducing this multiple
frequency-band operation.
The designed circuit exhibits remarkable 528 and 384 division ratios at 27.1 GHz and
24.7 GHz respectively, which to the best of our knowledge are the highest ILFD division
ratios reported in the literature, and which together with its low power consumption,
results in FoMs of 7.4 and 1114, respectively. The circuit does not require a large
internal inductor, resulting in a small die area of 0.048 mm${}^{2}$ including pads
and a compact 830 um${}^{2}$ excluding them, which is promising for realizing an efficient
integration with other circuits.
Fig. 7. Input frequency and division ratio vs. DC supply voltage in ILFD mode.
Fig. 8. Diagram of input frequency, locking range and division ratio (DR) for fixed
DC voltage in ILFD mode.
Fig. 9. Output spectra of the ILFD at (a) 10 kHz span and (b) 200 kHz.
Table 2. Performance of divider circuit for each frequency band operation ILFD.
Frequency [GHz]
|
2.434
|
4.350
|
6.243
|
12.594
|
19.114
|
21.631
|
24.679
|
27.1128
|
Locking Range [GHz]
|
0.992
|
1.735
|
2.088
|
1.900
|
0.628
|
0.940
|
1.509
|
0.007
|
PIN [dBm]
|
3.35
|
3.35
|
3.35
|
4
|
3.17
|
4
|
3.16
|
3.16
|
Division Ratio
|
48
|
96
|
96
|
192
|
288
|
336
|
384
|
528
|
PDC [mW]
|
0.88
|
0.86
|
1.14
|
1.09
|
1.08
|
0.96
|
1.05
|
0.926
|
VDD [V]
|
2.06
|
2.03
|
2.13
|
2.062
|
2.113
|
2
|
2.07
|
2.048
|
Table 3. Performance comparison of CMOS dividers.
References
|
[5]
|
[11]
|
[10]
|
[4]
|
[3]
|
[12]
|
This work
|
This work
|
CMOS Process [nm]
|
28
|
28
|
180
|
65
|
65
|
90
|
65
|
65
|
Freq. [GHz]
|
72
|
55.1
|
28
|
82.5
|
28.2
|
93.5
|
24.7
|
27.1
|
Stages
|
1
|
1
|
1
|
1
|
1
|
1
|
6
|
6
|
Division Ratio
|
2
|
3
|
3
|
3
|
3
|
3
|
384
|
528
|
Locking Range[GHz]
|
N/A
|
2.51
|
3.29
|
8.6
|
4.9
|
2.1
|
1.5
|
0.0073
|
PIN [dBm]
|
N/A
|
0
|
0
|
0
|
0
|
-2
|
3.16
|
3.16
|
Total PDC [mW]
|
12.4
|
8.8
|
5.13
|
7.88
|
5.18
|
3.25
|
1.05
|
0.926
|
FoM *
|
N/A
|
1.6
|
7.3
|
4.2
|
10
|
7.2
|
1114
|
7.4
|
Size with Pads [mm2]
Core Size [mm2]
|
N/A
0.00075
|
0.42
N/A
|
0.61
N/A
|
N/A
0.22
|
0.49
N/A
|
0.56
0.42
|
0.048
0.0008
|
0.048
0.0008
|
FoM
* = 100 x Division Ratio x Locking Range [GHz] / Center Freq [GHz] / Total P
DC [mW] / P
IN [mW]