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The Journal of Semiconductor Technology and Science (JSTS) is an international, peer-reviewed, and open-access journal that is published bimonthly.
- Scope: semiconductor processes, devices, circuits, and MEMS.
- Editor-in-Chief: Prof. Woo Young Choi (ECE, Seoul National University)
- Indexed within Science Citation Index Expanded (SCIE), SCOPUS, Korea Citation Index (KCI), and other databases.

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  3. 2025-04 (Vol.25 No.02)
  4. 10.5573/JSTS.2025.25.2.148
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References

1 
A. Kumar, M. Moradpour, M. Losito, W.-T. Franke, S. Ramasamy, R. Baccoli, and G. Gatto, ``Wide band gap devices and their application in power electronics,'' Energies, vol. 15, no. 23, 9172, 2022.DOI
2 
J. Lim, D. K. Jang, and S. W. Yoon, ``Novel temperature calibration method of E-mode and D-mode GaN power modules considering dynamic ON-resistance,'' IEEE Transactions on Industrial Electronics, vol. 71, no. 5, pp. 5245-5252, 2024.DOI
3 
S. W. Yoon, M. D. Glover, and K. Shiozaki, ``Nickel-tin transient liquid phase bonding toward high-temperature operational power electronics in electrified vehicles,'' IEEE Transactions on Power Electronics, vol. 28, no. 5, pp. 2448-2456, May 2013.DOI
4 
S. Jones-Jackson, R. Rodriguez, Y. Yang, L. Lopera, and A. Emadi, ``Overview of current thermal management of automotive power electronics for traction purposes and future directions,'' IEEE Transactions on Transportation Electrification, vol. 8, no. 2, pp. 2412-2428, June 2022.DOI
5 
J. Jeon, J. Seong, J. Lim, M. K. Kim, T. Kim, and S. W. Yoon, ``Finite element and experimental analysis of spacer designs for reducing the thermomechanical stress in double-sided cooling power modules,'' IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 9, no. 4, pp. 3883-3891, Aug 2021.DOI
6 
M. Liu, A. Coppola, M. Alvi, and M. Anwar, ``Comprehensive review and state of development of double-sided cooled package technology for automotive power modules,'' IEEE Open Journal of Power Electronics, vol. 3, pp. 271-289, May 2022.DOI
7 
S. Cho, S. Pyun, and S. W. Yoon, ``Analysis and design optimization of tilted rounded-rectangular pin-fins heat sink for xEV double-sided cooling power module,'' IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 12, no. 2, pp. 1803-1812, April 2024.DOI
8 
S. Pyun, S. Cho, and S.W. Yoon, ``Analysis of perforated pin design use in automotive SiC power module heatsink,'' Journal of Power Electronics, vol. 23, pp. 1888-1895, 2023.DOI
9 
S. Cho and S. W. Yoon, ``Analysis model for thermal resistance of double-sided cooling power module with pin-fin heat sink used in xEVs,'' Journal of Power Electronics, vol. 23, pp. 1880-1887, 2023.DOI
10 
S. Jahdi, O. Alatise, J. Ortiz-Gonzalez, P. Gammon, L. Ran, and P. Mawby, ``Investigation of parasitic turn-ON in silicon IGBT and silicon carbide MOSFET devices: A technology evaluation,'' Proc. of European Conference on Power Electronics and Applications (EPE'15), pp. 1-8, Geneva, Switzerland, September 2015.DOI
11 
Y. Zhang, H.-P. Nee, T. Hammam, I. Belov, P. Ranstad, and M. Bakowski, ``Multiphysics characterization of a novel SiC power module,'' IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 3, pp. 489-501, March 2019.DOI
12 
Y. Yang, Y.-C. Tseng, R. Rodriguez, A. D. Callegaro, and A. Emadi, ``Modeling and analysis of silver-sintered molybdenum packaging for SiC power modules with improved lifetime and temperature range,'' IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 12, pp. 2102-2113, Dec. 2021.DOI
13 
J. Broughton, V. Smet, R. R. Tummala, and Y. K. Joshi, ``Review of thermal packaging technologies for automotive power electronics for traction purposes,'' ASME Journal of Electronic Packaging, vol. 140, no. 4, December 2018DOI
14 
T. Zhang, B. G. Sammakia, Z. Yang, and H. Wang, ``Hybrid nanocomposite thermal interface materials: The thermal conductivity and the packing density,'' ASME Journal of Electronic Packaging, Vol. 140, no. 3, September 2018.DOI
15 
H. Fu, R. Fang, C. Tian, W. Qian, S. Cao, Z, Zhang, X. Xu, C, Yao, Z. Wang, and D. He, ``High-performance thermal interface materials enabled by vertical alignment of lightweight and soft graphene foams,'' Nano Res., vol. 17, pp. 9293-9299, 2024.DOI