F. Niklaus, A. Decharat, F. Forsberg, N. Roxhed, M. Lapisa, M. Populin, F. Zimmer,
J. Lemm, and G. Stemme, ``Wafer bonding with nano-imprint resists as sacrificial adhesive
for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of
MEMS and ICs,'' Sensors and Actuators A: Physical, vol. 154, no. 1, pp. 180-186, 2009.
