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Lee J. S., Kang G. H., Park C. H., Yu G. J., Ahn H. G., Han D. Y., 2011, Electrical Characteristics of PV Module According to Optical Characteristics of Back-sheet, The Korea Solar Energy Society, pp. 42-47Google Search
Kim C. H., 2017, Study on long-term reliability and environmental durability of flame-retardant back sheet for photovoltaic modules, Department of Integrated Materials Engineering, Chungwoon University Graduate SchoolGoogle Search
Frost & Sullivan , 2001, European flame retardant marketGoogle Search
Gale Group , 2001, U.S. Market Trend & ForecastsGoogle Search
Gerard J. F., 1999, Use of melamine with other minerals as flame retardants, Additives for Polymers, Vol. 11, No. 8Google Search
Kang S. H., 2014. 8, Study on the temperature variance and electrical characteristic of PV module by applying heat removal backsheet, Department of energy Engineering, Jeonbuk National University Graduate SchoolGoogle Search
Hong J. P., Yoon S. W., Hwang T. S., Oh J. S., Hong S. C., Lee Y. K., Nam J. D., 2012, High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers, Thermochimica Acta, Vol. 537, pp. 70-75DOI
Kim Namsu, Kim Dajung, Kang Hanjun, Park Yong-Gi, 2016, Improved heat dissipation in a crystalline silicon PV module for better performance by using a highly thermal conducting backsheet, Energy, Vol. 113, pp. 515-520DOI
Kim C. H., Jang H. T., Park J. S., Yoon J. K., Noh E. S., Park Jisoo, Koo K. W., 2018, Study on Thermal Conductive PV (PhotoVoltaic) Backsheet using MgO Masterbatch with High Thermal Conductivity, The Transactions of the Korean Institute of Electrical Engineers, Vol. 67, No. 3, pp. 448-453Google Search
Program on Technology Innovation , September 2016, Bifacial Solar Photovoltaic modules, EPRI (Electric Power Research Institute)Google Search
Meyer E. L., Ernest van Dyk E., 2004, Assessing the Reliability and Degradation of Photovoltaic Module Performance Parameters, IEEE Transactions on Reliability, Vol. 53, No. 1DOI