Mobile QR Code QR CODE : Journal of the Korean Institute of Illuminating and Electrical Installation Engineers

Journal of the Korean Institute of Illuminating and Electrical Installation Engineers

ISO Journal TitleJ Korean Inst. IIIum. Electr. Install. Eng.
Online Submission

Journal Search

  1. Home
  2. Archive
  3. 2025-02 (Vol.39 No.1)
  4. 10.5207/JIEIE.2025.39.1.65
XML PDF INFO REF

References

1 
J. E. Hwang, et al., “Study on insulation performance enhancement techniques for securing the operational reliability of power semiconductors,” Conf. on KIEES 2024, vol. 6, no. 1, pp. 523, 2024.URL
2 
K. H. Kim and S.H. Choa, “Recent overview on power semiconductor devices and package module technology,” Journal of MPS, vol. 26, no. 3, pp. 15-22, 2019.DOI
3 
J. E. Hwang, et al., “Electric field analysis of encapsulants for improving the insulation performance of power semiconductors,” Conf. on KIIEE 2024, vol. 1, no. 1, pp. 112, 2024.URL
4 
B. Zhang, et al., “Electrical properties of silicone gel for WBG-based power module packaging at high temperatures,” IEEE Transactions on Dielectrics and Electrical Insulation, vol. 30, no. 2, pp. 852-861, 2023.DOI
5 
K. Li, et al., “Electric field mitigation in high-voltage high-power IGBT modules using nonlinear conductivity composites,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 11, pp. 1844-1855, 2021.DOI
6 
J. Banaszczyk and B. Adamczyk, “Dielectric strength measurements of silicone gel,” 2016 Progress in Applied Electrical Engineering, vol. 1, no. 1, pp. 1-4, 2016.DOI
7 
P. Kvasnička, J. Pihera, and P. Prosr. “Dielectric analysis of silicone gels,” 2024 International Conference on Diagnostics in Electrical Engineering, vol. 1, no. 1, pp. 1-4, 2024.DOI
8 
K, Yangming, X. Cheng, and C. W. Macosko. “Degradation and breakdown of polymer/graphene composites under strong electric field,” Journal of Composites Science, vol. 6, no. 5, pp. 139, 2022.DOI
9 
H. Li, et al., “Dielectric properties of graphene-filled epoxy nanocomposite with enhanced thermal conductivity,” 2017 International Symposium on Electrical Insulating Materials, vol. 1, no. 1, pp. 149-152, 2017.DOI
10 
H. Park, et al., “Electric field analysis of encapsulants for improving the insulation performance of power semiconductors,” Conf. on KIIEE 2024, vol. 1, no. 1, pp. 113, 2024.URL
11 
COMSOL Inc., COMSOL Documentation, Available: https://www.comsol.com/documentation(Accessed Feb. 18, 2024).URL
12 
F. Yan, et al. “High temperature characteristics of composite materials composed of silicone gel and barium titanate in high voltage power modules,” IEEE Trans. on Industry Applications, vol. 59, no. 3, pp. 3648-3659, 2023.DOI
13 
S. Singha and M. J. Thomas, “Dielectric properties of epoxy nanocomposites,” in IEEE Transactions on Dielectrics and Electrical Insulation, vol. 15, no. 1, pp. 12-23, 2008.DOI
14 
P. Karunarathna, et al., “Study on dielectric properties of epoxy resin nanocomposites,” 2019 International Symposium on Advanced Electrical and Communication Technologies, vol. 1, no. 1, pp. 1-5, 2019.DOI