Mobile QR Code QR CODE

The Journal of Semiconductor Technology and Science (JSTS) is an international, peer-reviewed, and open-access journal that is published bimonthly.
- Scope: semiconductor processes, devices, circuits, and MEMS.
- Editor-in-Chief: Prof. Woo Young Choi (ECE, Seoul National University)
- Indexed within Science Citation Index Expanded (SCIE), SCOPUS, Korea Citation Index (KCI), and other databases.

Journal Search

  1. Home
  2. Archive
  3. 2025-04 (Vol.25 No.02)
  4. 10.5573/JSTS.2025.25.2.154
XML PDF INFO REF

References

1 
H. Wang, S. Wen, J. Liu, and G. Zhang, ``Effect of immersion cooling on the thermomechanical properties of printed circuit boards and reliability of electronic packages,'' Proc. of the 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Las Vegas, NV, USA, Jun. 2019URL
2 
C. C. Lee, K. S. Kao, and Y. C. Huang, ``Experimental and simulated verification of power cycling reliability for thin and low warpage power modules,'' IEEE Transactions on Power Electronics, vol. 39, no. 10, pp. 12478-12489, Oct. 2024DOI
3 
F. Forndran and M. Sprenger, ``Modelling warpage behavior of molded power modules for electric vehicles,'' Proc. of 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Italy, 2024.DOI
4 
M. Calabretta, A. Sitta, and F. Rundo, ``Warpage modeling for semiconductor power module manufacturing flow improvement,'' Journal of Engineering Manufacture, vol. 238, no. 4, pp. 538-548, 2024.DOI
5 
J. Cho and S. W. Yoon, ``Comparative analysis of epoxy molding compound (EMC) material properties used in double-sided cooling power moulde,'' Proc. of 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia), Jeju Island, Korea, 2023DOI
6 
Y. Wang, B. Yan, B. Yu, X. Tan, J. Pang, and G. Li, ``Improvement of warping simulation accuracy and influence factors analysis in FCBGA package,'' Proc. of the IEEE Electronic Components and Technology Conference (ECTC), Shenzhen, China, 2024DOI
7 
W. Yu, P. S. Y. Yang, C. Glancey, Y. C. Ong, and H. W. Ng, ``Package warpage modeling by considering shrinkage behavior of EMC and substrate,'' Proc. of 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), Singapore, 2021DOI
8 
Infineon power module, DSC module fixture.URL
9 
Y. Sun, H. S. Lee, and B. Han, ``Measurement of elastic properties of epoxy molding compound by single cylindrical configuration with embedded fiber Bragg grating sensor,'' Experimental Mechanics, vol. 57, no. 2, pp. 313-324, 2017.DOI
10 
D. Lee, H. Cho, B. Kong, and H. Choi, ``Investigation on curing characteristion of epoxy molding compounds with different latent catalysts by thermal, electrical and mechanical analysis,'' Thermochimica Acta, vol. 674, pp. 68-75, 2019.DOI
11 
C.-C. Su, C.-H. Wei, and C.-C. Yang, ``Elucidating how advanced organophosphine accelerators affect molding compounds: Toward high-performance electronic packaging materials,'' Industrial & Engineering Chemistry Research, vol. 52, no. 7, pp. 2528-2536, Jan. 2013.DOI
12 
D. G. Yang, S. Balakrishnan, and S. H. Lee, ``Strip warpage analysis of a flip chip package considering the mold compound processing parameters,'' Microelectronics Reliability, vol. 47, no. 8, pp. 1237-1244, Aug. 2007DOI
13 
Y. Sun, H.-S. Lee, and B. Han, ``Measurement of elastic properties of epoxy molding compound by single cylindrical configuration with embedded fiber Bragg grating sensor,'' Experimental Mechanics, vol. 57, no. 2, pp. 313-324, 2017.DOI
14 
Kim, M. Song, C.-Y. Gu, S. Ma, J. H. Lee, W.-S. Lee, and T.-S. Kim, ``Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound,'' Polymer Testing, vol. 125, 108140, Jul. 2023.DOI
15 
Y. Liu, Y. Liu, Z. Yuan, T. Chen, K. Lee, and S. Belani, ``Warpage analysis and improvement for a power module,'' Proc. of 2013 IEEE 63rd Electronic Components and Technology Conference, 2013DOI
16 
Hitachi Double-side Cooling Power Module from Audi e-tron’s Inverter.URL
17 
Z. Wu, J. Dong, C. Teng, X. Li, X. Zhao, X. Qin, C. Ji, and Q. Zhang, ``Polyimide-based composites reinforced by carbon nanotube-grafted carbon fiber for improved thermal conductivity and mechanical property,'' vol. 39, 101543, 2023DOI
18 
T. B. Hung, ``Thermal dissipation media for high power electronic devices using a carbon nanotube-based composite,'' Advances in Natural Sciences: Nanoscience and Nanotechnology, vol. 2, no. 2, 025002, 2011.DOI
19 
S. Cho, S. Pyun, and S. W. Yoon, ``Analysis model for thermal resistance of double-sided cooling power module with pin-fin heat sink used in xEVs,'' Journal of Power Electronics, vol. 23, pp. 1880-1887, 2023.DOI
20 
S. Cho, S. Pyun, and S. W. Yoon, ``Analysis and design optimization of tilted rounded-rectangular pin-fins heat sink for xEV double-sided cooling power module,'' IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 12, no. 2, pp. 1803-1812, Apr. 2024.DOI
21 
J. L. Pfister and O. Marquet, ``Fluid–structure stability analyses and nonlinear dynamics of flexible splitter plates interacting with a circular cylinder flow,'' Journal of Fluid Mechanics, vol. 896, A24, 2020.DOI