JIEIE
Journal of the Korean Institute of Illuminating
and Electrical Installation Engineers
KIIEE
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ISSN : 1229-4691 (Print)
ISSN : 2287-5034 (Online)
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Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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J Korean Inst. IIIum. Electr. Install. Eng.
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2024-04
(Vol.38 No.2)
10.5207/JIEIE.2024.38.2.118
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References
1
Eric bogatin, “Signal integrity,” Pearson Education, pp. 615-630, 2010.
2
Li zhai, “EMC of EV,” Wiley, pp. 308-309, 2021.
3
Henry W. Ott, “Electromagnetic compatibility engineering,” Wiley, pp. 3-40, 2009.
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Mark I. Montrose, “EMC made simple : Printed circuit board and system,” Montrose Compliance Services, pp. 123-124, 2014.
5
Tim Williams, “EMC for product designer,” Elsevier Science, pp. 463-466, 2016.
6
Eric Bogatin, “Bogatin’s practical guide to prototype bread board and PCB design,” ARTECH HOUSE, pp. 315-330, 2021.
7
Guangzhao Li, Li Zhai, “Optimization design method of decoupling capacitor in PCB hardware of electric vehicle controller,” Energy Procedia, vol. 105, pp. 3201-3206, 2017.
8
J. H. Kim, J. K. Yu, B. K. Kim, and W. S. Nah, “Optimization research of decoupling capacitor and practical using Q-factor,” KIEE Sumer Conference, pp. 2206-2209, 2009.
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S. K. Kim, T. H. Chung, J. H. Jung, and K. S. Lee, “HPCU EMC performance enhancement through PI analysis,” KSAE Fall Conference, pp. 2982-2987, 2010.
10
Y. C. Nam, Y. S. Park, and M. J. Kim, “EMI improvement of printed circuit board using a decoupling capacitor,” IEIE Summer Conference, pp. 198-200, 2015.
11
NXP, “Hardware design guidelines for S32K1xx microcontrollers,” 2021.
12
Murata, “Application manual for power supply noise suppression and decoupling for digital IC,” 2010.